Liu Houbao, Ji Xiaohu, Wang Wei, Zhou Lihua
School of Mechanical and Vehicle Engineering, West Anhui University, Lu'an 237012, China.
Anhui Province Key Laboratory of Aerospace Structural Parts Forming Technology and Equipment, Hefei University of Technology, Hefei 230009, China.
Materials (Basel). 2024 May 16;17(10):2400. doi: 10.3390/ma17102400.
The rapid development of miniaturized, high-frequency, and highly integrated microelectronic devices has brought about critical issues in electromagnetic compatibility and thermal management. In recent years, there has been significant interest in lightweight polymer-based composites that offer both electromagnetic interference (EMI) shielding and thermal conductivity. One promising approach involves constructing three-dimensional (3D) interconnection networks using functional fillers in the polymer matrix. These networks have been proven effective in enhancing the thermal and electrical conductivity of the composites. This mini-review focuses on the preparation and properties of 3D network-reinforced polymer composites, specifically those incorporating metal, carbon, ceramic, and hybrid networks. By comparing the effects of different filler types and distribution on the composite materials, the advantages of 3D interconnected conductive networks in polymer composites are highlighted. Additionally, this review addresses the challenges faced in the field of multifunctional thermal management and electromagnetic protection materials and provides insights into future development trends and application prospects of 3D structured composites.
小型化、高频化和高度集成化微电子设备的快速发展带来了电磁兼容性和热管理方面的关键问题。近年来，兼具电磁干扰（EMI）屏蔽和热导率的轻质聚合物基复合材料受到了广泛关注。一种很有前景的方法是在聚合物基体中使用功能填料构建三维（3D）互连网络。这些网络已被证明能有效提高复合材料的热导率和电导率。本综述聚焦于3D网络增强聚合物复合材料的制备及性能，特别是那些包含金属、碳、陶瓷和混合网络的复合材料。通过比较不同填料类型和分布对复合材料的影响，突出了3D互连导电网络在聚合物复合材料中的优势。此外，本综述探讨了多功能热管理和电磁防护材料领域面临的挑战，并对3D结构复合材料的未来发展趋势和应用前景提供了见解。
