Direct Ink Writing of SiCN/RuO/TiB Composite Ceramic Ink for High-Temperature Thin-Film Sensors.

Direct ink writing (DIW) of high-temperature thin-film sensors holds significant potential for monitoring extreme environments. However, existing high-temperature inks face a trade-off between cost and performance. This study proposes a SiCN/RuO/TiB composite ceramic ink. The added TiB, after annealing in a high-temperature atmospheric environment, forms BO glass, which synergizes with the SiO glass phase formed from the SiCN precursor to effectively encapsulate RuO particles. This enhances the film's density and adhesion to the substrate, preventing RuO volatilization at high temperatures. Additionally, the high conductivity of TiB improves the film's overall conductivity. Test results indicate that the SiCN/RuO/TiB film exhibits high linearity from room temperature to 900 °C, high stability (resistance drift rate of 0.1%/h at 800 °C), and high conductivity (4410 S/m). As a proof of concept, temperature sensors and a heat flux sensor were successfully fabricated on a metallic hemispherical surface. Performance tests in extreme environments using high-power lasers and flame guns verified that the conformal thin-film sensor can accurately measure spherical temperature and heat flux, with a heat flux sensor response time of 53 ms. In conclusion, the SiCN/RuO/TiB composite ceramic ink developed in this study offers a high-performance and cost-effective solution for high-temperature conformal thin-film sensors in extreme environments.