Lu Tian, Xue Junying, Shen Penghui, Liu Houfang, Gao Xiaoyue, Li Xiaomei, Hao Jian, Huang Dapeng, Zhao Ruiting, Yan Jianlan, Yang Mingdong, Yan Bonan, Gao Peng, Lin Zhaoyang, Yang Yi, Ren Tian-Ling
School of Integrated Circuits and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China.
Department of Chemistry, Tsinghua University, Beijing, China.
Sci Adv. 2024 Sep 6;10(36):eadp0174. doi: 10.1126/sciadv.adp0174. Epub 2024 Sep 4.
Computing in memory (CIM) breaks the conventional von Neumann bottleneck through in situ processing. Monolithic integration of digital and analog CIM hardware, ensuring both high precision and energy efficiency, provides a sustainable paradigm for increasingly sophisticated artificial intelligence (AI) applications but remains challenging. Here, we propose a complementary metal-oxide semiconductor-compatible ferroelectric hybrid CIM platform that consists of Boolean logic and triggers for digital processing and multistage cell arrays for analog computation. The basic ferroelectric-gated units are assembled with solution-processable two-dimensional (2D) molybdenum disulfide atomic-thin channels at a wafer-scale yield of 96.36%, delivering high on/off ratios (>10), high endurance (>10), long retention time (>10 years), and ultralow cycle-to-cycle/device-to-device variations (0.3%/0.5%). Last, we customize a highly compact 2D hybrid CIM system for dynamic tracking, achieving a high accuracy of 99.8% and a 263-fold improvement in power efficiency compared to graphics processing units. These results demonstrate the potential of 2D fully ferroelectric-gated hybrid hardware for developing versatile CIM blocks for AI tasks.
内存计算(CIM)通过原位处理打破了传统的冯·诺依曼瓶颈。数字和模拟CIM硬件的单片集成,既保证了高精度又实现了能源效率,为日益复杂的人工智能(AI)应用提供了一种可持续的范式,但仍然具有挑战性。在此,我们提出了一种互补金属氧化物半导体兼容的铁电混合CIM平台,该平台由用于数字处理的布尔逻辑和触发器以及用于模拟计算的多级单元阵列组成。基本的铁电门控单元在晶圆规模上以96.36%的良率与可溶液处理的二维(2D)二硫化钼原子薄通道组装在一起,具有高开/关比(>10)、高耐久性(>10)、长保持时间(>10年)以及超低的周期间/器件间变化(0.3%/0.5%)。最后,我们定制了一个用于动态跟踪的高度紧凑的二维混合CIM系统,与图形处理单元相比,实现了99.8%的高精度和263倍的功率效率提升。这些结果证明了二维全铁电门控混合硬件在开发用于人工智能任务的通用CIM模块方面的潜力。