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高密度神经电极阵列中的寄生电容:来源与评估方法

Parasitic Capacitance in High-Density Neural Electrode Arrays: Sources and Evaluation Methods.

作者信息

Ghazavi A, Troyk P R, Cogan S F

出版信息

IEEE Trans Biomed Eng. 2025 Feb;72(2):794-802. doi: 10.1109/TBME.2024.3472708. Epub 2025 Jan 21.

DOI:10.1109/TBME.2024.3472708
PMID:39374275
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11875893/
Abstract

OBJECTIVE

This study aims to identify sources of parasitic capacitance in high-density neural electrode arrays and to provide an approach for evaluating their associated capacitance values. We also represent the effect of parasitic capacitance on the electrochemical properties of electrodes.

METHODS

Electrochemical impedance spectroscopy (EIS) and voltage transient (VT) measurements were employed to assess the parasitic capacitance of a 16-channel ultramicro-sized electrode array (UMEA) (8 × 25 µm electrode sites). The effect of parasitic capacitance on cyclic voltammetry (CV), EIS, and VT measurements of 20-µm diameter electrodes was assessed by comparing two different array designs: narrow and wide trace arrays.

RESULTS

The capacitive leakage currents and charge during CV measurements were not significant, however, during current pulsing 34% underestimation of the maximum charge injection capacity corresponded to capacitive leakage. Capacitive leakage during EIS resulted in an underestimation of the electrode impedance at frequencies >1.5 kHz.

CONCLUSION

The electrode design and insulation thickness can play a significant role in determining the amount of capacitive leakage during current pulsing and EIS at higher frequencies.

SIGNIFICANCE

Determining the sources and levels of capacitive leakage current in high-density neural electrode arrays, enables us to correct the measured value for the leakage current and thus estimate the electrode impedance and stimulation thresholds more accurately. This study highlights the importance of electrode design in developing high-density arrays with minimum capacitive leakage.

摘要

目的

本研究旨在识别高密度神经电极阵列中寄生电容的来源,并提供一种评估其相关电容值的方法。我们还展示了寄生电容对电极电化学特性的影响。

方法

采用电化学阻抗谱(EIS)和电压瞬变(VT)测量来评估一个16通道超微尺寸电极阵列(UMEA)(电极位点为8×25µm)的寄生电容。通过比较两种不同的阵列设计:窄迹线阵列和宽迹线阵列,评估寄生电容对直径为20µm电极的循环伏安法(CV)、EIS和VT测量的影响。

结果

CV测量期间的电容性泄漏电流和电荷不显著,然而,在电流脉冲期间,最大电荷注入容量被低估了34%,这与电容性泄漏相对应。EIS期间的电容性泄漏导致在频率>1.5kHz时电极阻抗被低估。

结论

电极设计和绝缘厚度在确定高频下电流脉冲和EIS期间的电容性泄漏量方面可发挥重要作用。

意义

确定高密度神经电极阵列中电容性泄漏电流的来源和水平,使我们能够校正泄漏电流的测量值,从而更准确地估计电极阻抗和刺激阈值。本研究强调了电极设计在开发具有最小电容性泄漏的高密度阵列中的重要性。

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