Zhuang Hua-Lu, Cai Bowen, Pan Yu, Su Bin, Jiang Yilin, Pei Jun, Liu Fengming, Hu Haihua, Yu Jincheng, Li Jing-Wei, Wang Zhengqin, Han Zhanran, Li Hezhang, Wang Chao, Li Jing-Feng
State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
Guangxi Pilot Free Trade Zone Jianju Technology Co., LTD., Qinzhou 535000, China.
Natl Sci Rev. 2024 Sep 16;11(10):nwae329. doi: 10.1093/nsr/nwae329. eCollection 2024 Oct.
Thermoelectric Peltier coolers (PCs) are being increasingly used as temperature stabilizers for optoelectronic devices. Increasing integration drives PC miniaturization, requiring thermoelectric materials with good strength. We demonstrate a simultaneous gain of thermoelectric and mechanical performance in (Bi, Sb)Te, and successfully fabricate micro PCs (2 × 2 mm cross-section) that show excellent maximum cooling temperature difference of 89.3 K with a hot-side temperature of 348 K. A multi-step process involving annealing, hot-forging and composition design, is developed to modify the atomic defects and nano- and microstructures. The peak is improved to ∼1.50 at 348 K, and the flexural and compressive strengths are significantly enhanced to ∼140 MPa and ∼224 MPa, respectively. These achievements hold great potential for advancing solid-state refrigeration technology in small spaces.
热电珀耳帖冷却器(PCs)正越来越多地被用作光电器件的温度稳定器。日益增加的集成度推动了PC的小型化,这就需要具有良好强度的热电材料。我们展示了在(Bi,Sb)Te中热电性能和机械性能的同时提升,并成功制造出了微型PC(横截面为2×2毫米),在热端温度为348 K时,其显示出高达89.3 K的出色最大冷却温差。开发了一种包括退火、热锻和成分设计的多步工艺,以改变原子缺陷以及纳米和微观结构。在348 K时,峰值提高到约1.50,弯曲强度和抗压强度分别显著提高到约140 MPa和约224 MPa。这些成果在推动小空间内的固态制冷技术方面具有巨大潜力。