Shangguan Qiwei, Lv Yawei, Jiang Changzhong
School of Physics and Electronics, Hunan University, Changsha 410082, China.
College of Materials Science and Engineering, Hunan University, Changsha 410082, China.
Nanomaterials (Basel). 2024 Oct 19;14(20):1679. doi: 10.3390/nano14201679.
Although the irreplaceable position of silicon (Si) semiconductor materials in the field of information has become a consensus, new materials continue to be sought to expand the application range of semiconductor devices. Among them, research on wide bandgap semiconductors has already achieved preliminary success, and the relevant achievements have been applied in the fields of energy conversion, display, and storage. However, similar to the history of Si, the immature material grown and device manufacturing processes at the current stage seriously hinder the popularization of wide bandgap semiconductor-based applications, and one of the crucial issues behind this is the defect problem. Here, we take amorphous indium gallium zinc oxide (a-IGZO) and 4H silicon carbide (4H-SiC) as two representatives to discuss physical/mechanical properties, electrical performance, and stability from the perspective of defects. Relevant experimental and theoretical works on defect formation, evolution, and annihilation are summarized, and the impacts on carrier transport behaviors are highlighted. State-of-the-art applications using the two materials are also briefly reviewed. This review aims to assist researchers in elucidating the complex impacts of defects on electrical behaviors of wide bandgap semiconductors, enabling them to make judgments on potential defect issues that may arise in their own processes. It aims to contribute to the effort of using various post-treatment methods to control defect behaviors and achieve the desired material and device performance.
尽管硅(Si)半导体材料在信息领域的不可替代地位已成为共识,但人们仍在不断寻找新材料以扩大半导体器件的应用范围。其中,宽带隙半导体的研究已取得初步成功,相关成果已应用于能量转换、显示和存储等领域。然而,与硅的发展历程类似,现阶段材料生长和器件制造工艺的不成熟严重阻碍了基于宽带隙半导体的应用的普及,而这背后的关键问题之一就是缺陷问题。在此,我们以非晶铟镓锌氧化物(a-IGZO)和4H碳化硅(4H-SiC)作为两个代表,从缺陷的角度讨论物理/机械性能、电学性能和稳定性。总结了有关缺陷形成、演化和湮灭的相关实验和理论工作,并突出了其对载流子输运行为的影响。还简要回顾了使用这两种材料的最新应用。本综述旨在帮助研究人员阐明缺陷对宽带隙半导体电学行为的复杂影响,使他们能够对自身工艺中可能出现的潜在缺陷问题做出判断。旨在为利用各种后处理方法控制缺陷行为并实现所需的材料和器件性能做出贡献。