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一款CMOS-MEMS平面外检测陀螺仪的设计与实现

Design and Implementation of a CMOS-MEMS Out-of-Plane Detection Gyroscope.

作者信息

Tian Huimin, Zhang Zihan, Liu Li, Wei Wenqiang, Cao Huiliang

机构信息

Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Taiyuan 030051, China.

School of Information and Software Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China.

出版信息

Micromachines (Basel). 2024 Dec 10;15(12):1484. doi: 10.3390/mi15121484.

DOI:10.3390/mi15121484
PMID:39770237
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11679517/
Abstract

A MEMS gyroscope is a critical sensor in attitude control platforms and inertial navigation systems, which has the advantages of small size, light weight, low energy consumption, high reliability and strong anti-interference capability. This paper presents the design, simulation and fabrication of a Y-axis gyroscope with out-of-plane detection developed using CMOS-MEMS technology. The structural dimensions of the gyroscope were optimized through a multi-objective genetic algorithm, and modal, harmonic response and range simulation analyses were carried out to verify the reasonableness of the design. The chip measured 1.2 mm × 1.3 mm. The simulation results indicate that the driving and detecting frequencies of the gyroscope were 9215.5 Hz and 9243.5 Hz, respectively; the Q-factors were 83,790 and 46,085; the mechanical sensitivity was 4.87 × 10 m/°/s; and the operational range was ±600°/s. Chip testing shows that the static capacitance was consistent with the preset value. The error between the measured frequency characteristics and the simulation results was 1.9%. This design establishes a foundation for the integration of the gyroscope's structure and circuitry.

摘要

微机电系统(MEMS)陀螺仪是姿态控制平台和惯性导航系统中的关键传感器,具有体积小、重量轻、能耗低、可靠性高和抗干扰能力强等优点。本文介绍了一种采用CMOS-MEMS技术开发的具有面外检测功能的Y轴陀螺仪的设计、仿真和制造。通过多目标遗传算法对陀螺仪的结构尺寸进行了优化,并进行了模态、谐波响应和量程仿真分析,以验证设计的合理性。该芯片尺寸为1.2 mm×1.3 mm。仿真结果表明,陀螺仪的驱动频率和检测频率分别为9215.5 Hz和9243.5 Hz;品质因数分别为83790和46085;机械灵敏度为4.87×10 m/°/s;工作量程为±600°/s。芯片测试表明,静态电容与预设值一致。实测频率特性与仿真结果之间的误差为1.9%。该设计为陀螺仪结构与电路的集成奠定了基础。

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本文引用的文献

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A Review of MEMS Vibrating Gyroscopes and Their Reliability Issues in Harsh Environments.MEMS 振动陀螺仪综述及其在恶劣环境中的可靠性问题
Sensors (Basel). 2022 Sep 29;22(19):7405. doi: 10.3390/s22197405.
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Development Trends and Perspectives of Future Sensors and MEMS/NEMS.未来传感器及微机电系统/纳机电系统的发展趋势与展望
Micromachines (Basel). 2019 Dec 18;11(1):7. doi: 10.3390/mi11010007.
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Implementation of a CMOS/MEMS Accelerometer with ASIC Processes.采用专用集成电路工艺实现的互补金属氧化物半导体/微机电系统加速度计
Micromachines (Basel). 2019 Jan 12;10(1):50. doi: 10.3390/mi10010050.
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CMOS MEMS Fabrication Technologies and Devices.互补金属氧化物半导体微机电系统制造技术与器件
Micromachines (Basel). 2016 Jan 21;7(1):14. doi: 10.3390/mi7010014.
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The development of micromachined gyroscope structure and circuitry technology.微机械陀螺仪结构与电路技术的发展
Sensors (Basel). 2014 Jan 14;14(1):1394-473. doi: 10.3390/s140101394.