Zhang Jiarui, Li Yikun, Luo Shijun, Zhang Yan, Luo Man, Wang Hailu, Yu Chenhui
National Key Laboratory of Infrared Detection Technologies, School of Microelectronics and Integrated Circuits (Jiangsu Key Laboratory of Semi. Dev. & IC Design, Package and Test), Nantong University, Nantong 226019, China.
State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China.
Nanomaterials (Basel). 2025 Aug 7;15(15):1209. doi: 10.3390/nano15151209.
Hexagonal Boron Nitride (-BN) is an exceptional dielectric material with significant potential for high-performance electronic and optoelectronic devices. While previous studies have explored its role in GaN-based MIS (metal/insulator/semiconductor) structures, the influence of few-layer -BN on AlGaN MIS devices-particularly with varying Al compositions-remains unexplored. In this work, we systematically investigate the Fowler-Nordheim tunneling effect in few-layer -BN integrated into AlGaN MIS architectures, focusing on the critical roles -BN layer count, AlGaN alloy composition, and interfacial properties in determining device performance. Through combined simulations and experiments, we accurately determine key physical parameters, such as the layer-dependent effective mass and band alignment, and analyze their role in optimizing MIS device characteristics. Our findings reveal that the 2D -BN insulating layer not only enhances breakdown voltage and reduces leakage current but also mitigates interfacial defects and Shockley-Read-Hall recombination, enabling high-performance AlGaN MIS devices under elevated voltage and power conditions. This study provides fundamental insights into -BN-based AlGaN MIS structures and advances their applications in next-generation high-power and high-frequency electronics.
六方氮化硼(h-BN)是一种特殊的介电材料,在高性能电子和光电器件方面具有巨大潜力。虽然先前的研究已经探讨了其在基于氮化镓(GaN)的金属/绝缘体/半导体(MIS)结构中的作用,但少层h-BN对氮化铝镓(AlGaN)MIS器件的影响,特别是在不同铝成分下的影响,仍未得到探索。在这项工作中,我们系统地研究了集成到AlGaN MIS结构中的少层h-BN中的福勒-诺德海姆隧穿效应,重点关注h-BN层数、AlGaN合金成分和界面特性在决定器件性能方面的关键作用。通过联合模拟和实验,我们准确地确定了关键物理参数,如与层相关的有效质量和能带排列,并分析了它们在优化MIS器件特性中的作用。我们的研究结果表明,二维h-BN绝缘层不仅提高了击穿电压并降低了漏电流,还减轻了界面缺陷和肖克利-里德-霍尔复合,从而在高电压和高功率条件下实现了高性能AlGaN MIS器件。这项研究为基于h-BN的AlGaN MIS结构提供了基本见解,并推动了它们在下一代高功率和高频电子学中的应用。