Jackman R J, Wilbur J L, Whitesides G M
Department of Chemistry, Harvard University, Cambridge, MA 02138, USA.
Science. 1995 Aug 4;269(5224):664-6. doi: 10.1126/science.7624795.
Microcontact printing (mu CP) has been used to produce patterned self-assembled monolayers (SAMs) with submicrometer features on curved substrates with radii of curvature as small as 25 micrometers. Wet-chemical etching that uses the patterned SAMs as resists transfers the patterns formed by mu CP into gold. At present, there is no comparable method for microfabrication on curved surfaces.
微接触印刷（μCP）已被用于在曲率半径小至25微米的弯曲基板上制备具有亚微米特征的图案化自组装单分子层（SAMs）。使用图案化SAMs作为抗蚀剂的湿化学蚀刻将μCP形成的图案转移到金上。目前，尚无用于在曲面上进行微加工的可比方法。
