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柔性高性能碳纳米管集成电路。

Flexible high-performance carbon nanotube integrated circuits.

机构信息

Department of Quantum Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan.

出版信息

Nat Nanotechnol. 2011 Mar;6(3):156-61. doi: 10.1038/nnano.2011.1. Epub 2011 Feb 6.

DOI:10.1038/nnano.2011.1
PMID:21297625
Abstract

Carbon nanotube thin-film transistors are expected to enable the fabrication of high-performance, flexible and transparent devices using relatively simple techniques. However, as-grown nanotube networks usually contain both metallic and semiconducting nanotubes, which leads to a trade-off between charge-carrier mobility (which increases with greater metallic tube content) and on/off ratio (which decreases). Many approaches to separating metallic nanotubes from semiconducting nanotubes have been investigated, but most lead to contamination and shortening of the nanotubes, thus reducing performance. Here, we report the fabrication of high-performance thin-film transistors and integrated circuits on flexible and transparent substrates using floating-catalyst chemical vapour deposition followed by a simple gas-phase filtration and transfer process. The resulting nanotube network has a well-controlled density and a unique morphology, consisting of long (~10 µm) nanotubes connected by low-resistance Y-shaped junctions. The transistors simultaneously demonstrate a mobility of 35 cm(2) V(-1) s(-1) and an on/off ratio of 6 × 10(6). We also demonstrate flexible integrated circuits, including a 21-stage ring oscillator and master-slave delay flip-flops that are capable of sequential logic. Our fabrication procedure should prove to be scalable, for example, by using high-throughput printing techniques.

摘要

碳纳米管薄膜晶体管有望利用相对简单的技术来制造高性能、柔性和透明器件。然而,生长得到的纳米管网络通常同时包含金属和半导体纳米管,这导致电荷载流子迁移率(随金属管含量增加而增加)和开关比(随金属管含量降低而降低)之间存在权衡。已经研究了许多从半导体纳米管中分离金属纳米管的方法,但大多数方法会导致纳米管污染和缩短,从而降低性能。在这里,我们报告了使用浮动催化剂化学气相沉积法,然后通过简单的气相过滤和转移工艺,在柔性透明衬底上制造高性能薄膜晶体管和集成电路。得到的纳米管网络具有良好控制的密度和独特的形态,由长约 10 μm 的纳米管通过低电阻 Y 形结连接而成。晶体管同时表现出 35 cm(2) V(-1) s(-1)的迁移率和 6×10(6)的开关比。我们还展示了柔性集成电路,包括一个 21 级环形振荡器和能够进行顺序逻辑的主从延迟触发器。我们的制造工艺应该具有可扩展性,例如通过使用高通量打印技术。

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