Orcutt Jason S, Khilo Anatol, Holzwarth Charles W, Popović Milos A, Li Hanqing, Sun Jie, Bonifield Thomas, Hollingsworth Randy, Kärtner Franz X, Smith Henry I, Stojanović Vladimir, Ram Rajeev J
Research Laboratory of Electronics, Massachusetts Institute of Technology, 77 Massachusetts Ave, Cambridge, Massachusetts 02139, USA.
Opt Express. 2011 Jan 31;19(3):2335-46. doi: 10.1364/OE.19.002335.
We demonstrate a monolithic photonic integration platform that leverages the existing state-of-the-art CMOS foundry infrastructure. In our approach, proven XeF2 post-processing technology and compliance with electronic foundry process flows eliminate the need for specialized substrates or wafer bonding. This approach enables intimate integration of large numbers of nanophotonic devices alongside high-density, high-performance transistors at low initial and incremental cost. We demonstrate this platform by presenting grating-coupled, microring-resonator filter banks fabricated in an unmodified 28 nm bulk-CMOS process by sharing a mask set with standard electronic projects. The lithographic fidelity of this process enables the high-throughput fabrication of second-order, wavelength-division-multiplexing (WDM) filter banks that achieve low insertion loss without post-fabrication trimming.
我们展示了一个利用现有最先进的CMOS代工基础设施的单片光子集成平台。在我们的方法中,经过验证的XeF2后处理技术以及对电子代工工艺流程的遵循消除了对专用衬底或晶圆键合的需求。这种方法能够以较低的初始成本和增量成本,将大量纳米光子器件与高密度、高性能晶体管紧密集成。我们通过展示在未修改的28纳米体CMOS工艺中制造的光栅耦合微环谐振器滤波器组来演示这个平台,该滤波器组通过与标准电子项目共享掩模组来实现。这一工艺的光刻保真度使得能够高通量制造二阶波分复用(WDM)滤波器组,这些滤波器组无需制造后微调即可实现低插入损耗。