Deng Xiao, Namboodiri Pradeep, Li Kai, Wang Xiqiao, Stan Gheorghe, Myers Alline F, Cheng Xinbin, Li Tongbao, Silver Richard M
School of Physics Science and Engineering, Tongji University, Shanghai 200092, People's Republic of China; National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States.
National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States.
Appl Surf Sci. 2016 Aug 15;378:301-307. doi: 10.1016/j.apsusc.2016.03.212. Epub 2016 Mar 31.
Low temperature Si epitaxy has become increasingly important due to its critical role in the encapsulation and performance of buried nanoscale dopant devices. We demonstrate epitaxial growth up to nominally 25 nm, at 250°C, with analysis at successive growth steps using STM and cross section TEM to reveal the nature and quality of the epitaxial growth. STM images indicate that growth morphology of both Si on Si and Si on H-terminated Si (H: Si) is epitaxial in nature at temperatures as low as 250 °C. For Si on Si growth at 250 °C, we show that the Si epitaxial growth front maintains a constant morphology after reaching a specific thickness threshold. Although the in-plane mobility of silicon is affected on the H: Si surface due to the presence of H atoms during initial sub-monolayer growth, STM images reveal long range order and demonstrate that growth proceeds by epitaxial island growth albeit with noticeable surface roughening.
低温硅外延由于其在掩埋纳米级掺杂器件的封装和性能方面的关键作用而变得越来越重要。我们展示了在250°C下名义上高达25nm的外延生长,并在连续生长步骤中使用STM和横截面TEM进行分析,以揭示外延生长的性质和质量。STM图像表明,在低至250°C的温度下,Si/Si和Si/H端接Si(H:Si)上的Si生长形态本质上都是外延的。对于在250°C下的Si/Si生长,我们表明Si外延生长前沿在达到特定厚度阈值后保持恒定的形态。尽管在初始亚单层生长期间由于H原子的存在,硅的面内迁移率在H:Si表面上受到影响,但STM图像揭示了长程有序,并表明生长通过外延岛生长进行,尽管表面有明显的粗糙化。