Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA.
Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, South Korea.
Nat Commun. 2017 Jun 21;8:15894. doi: 10.1038/ncomms15894.
Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.
由于其在连续、临床质量健康监测和先进的生物电子治疗方面的新兴应用，旨在与人体软组织紧密接口的低模量、柔顺系统的传感器、电路和无线电越来越受到关注。尽管最近的研究为这些技术确立了各种材料和力学概念，但所有现有的方法都涉及组成微组件和互连的简单二维（2D）布局。在这里，我们介绍了三维（3D）架构中的概念，这些概念绕过了由传统二维设计设定的重要工程约束和性能限制。具体来说，通过确定性压缩屈曲形成的螺旋微线圈的开放式网格 3D 互连网络为系统奠定了基础，这些系统可以在紧凑的几何形状中提供出色的低模量、弹性力学特性，同时具有有源组件和复杂程度的功能。机械和电气设计方法的结合使布局优化、组装工艺和封装方案能够产生满足复杂系统（如无线、皮肤兼容电子传感器）苛刻要求的 3D 配置。
