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用于脑机接口的新型高密度三维金字塔形微电极阵列上碳纳米管的直接生长

Direct Growth of Carbon Nanotubes on New High-Density 3D Pyramid-Shaped Microelectrode Arrays for Brain-Machine Interfaces.

作者信息

Ghane Motlagh Bahareh, Choueib May, Hajhosseini Mesgar Alireza, Hasanuzzaman Md, Sawan Mohamad

机构信息

Polystim Neurotechnologies Laboratory, Department of Electrical Engineering, Polytechnique Montreal, Montreal, QC H3C 3A7, Canada.

Institut Lumière Matière, Université Claude Bernard Lyon 1, CNRS, Univ Lyon, Villeurbanne 69622, France.

出版信息

Micromachines (Basel). 2016 Sep 8;7(9):163. doi: 10.3390/mi7090163.

Abstract

Silicon micromachined, high-density, pyramid-shaped neural microelectrode arrays (MEAs) have been designed and fabricated for intracortical 3D recording and stimulation. The novel architecture of this MEA has made it unique among the currently available micromachined electrode arrays, as it has provided higher density contacts between the electrodes and targeted neural tissue facilitating recording from different depths of the brain. Our novel masking technique enhances uniform tip-exposure for variable-height electrodes and improves process time and cost significantly. The tips of the electrodes have been coated with platinum (Pt). We have reported for the first time a selective direct growth of carbon nanotubes (CNTs) on the tips of 3D MEAs using the Pt coating as a catalyzer. The average impedance of the CNT-coated electrodes at 1 kHz is 14 kΩ. The CNT coating led to a 5-fold decrease of the impedance and a 600-fold increase in charge transfer compared with the Pt electrode.

摘要

硅微机械加工的高密度金字塔形神经微电极阵列(MEA)已被设计和制造用于皮层内三维记录和刺激。这种MEA的新颖架构使其在目前可用的微机械加工电极阵列中独树一帜,因为它在电极与目标神经组织之间提供了更高密度的接触,便于从大脑的不同深度进行记录。我们新颖的掩膜技术增强了可变高度电极的均匀尖端暴露,并显著缩短了加工时间和成本。电极尖端已涂有铂(Pt)。我们首次报道了以Pt涂层为催化剂在三维MEA尖端选择性直接生长碳纳米管(CNT)。碳纳米管涂层电极在1kHz时的平均阻抗为14kΩ。与铂电极相比,碳纳米管涂层使阻抗降低了5倍,电荷转移增加了600倍。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6c6b/6189795/7e540ebd7246/micromachines-07-00163-g001.jpg

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