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基于镜像力势垒降低的水平栅极单层二硫化钼晶体管

A Horizontal-Gate Monolayer MoS Transistor Based on Image Force Barrier Reduction.

作者信息

Yang Kun, Liu Hongxia, Wang Shulong, Li Wei, Han Tao

机构信息

Key Laboratory for Wide-Band Gap Semiconductor Materials and Devices of Education, The School of Microelectronics, Xidian University, Xi'an 710071, China.

出版信息

Nanomaterials (Basel). 2019 Sep 2;9(9):1245. doi: 10.3390/nano9091245.

Abstract

Transition metal dichalcogenides (TMDCs) have received wide attention as a new generation of semiconductor materials. However, there are still many problems to be solved, such as low carrier mobility, contact characteristics between metal and two-dimensional materials, and complicated fabrication processes. In order to overcome these problems, a large amount of research has been carried out so that the performance of the device has been greatly improved. However, most of these studies are based on complicated fabrication processes which are not conducive to the improvement of integration. In view of this problem, a horizontal-gate monolayer MoS transistor based on image force barrier reduction is proposed, in which the gate is in the same plane as the source and drain and comparable to back-gated transistors on-off ratios up to 1 × 10 have been obtained. Subsequently, by combining the Y-Function method (YFM) and the proposed diode equivalent model, it is verified that Schottky barrier height reduction is the main reason giving rise to the observed source-drain current variations. The proposed structure of the device not only provides a new idea for the high integration of two-dimensional devices, but also provides some help for the study of contact characteristics between two-dimensional materials and metals.

摘要

过渡金属二硫属化物(TMDCs)作为新一代半导体材料受到了广泛关注。然而,仍有许多问题有待解决,如载流子迁移率低、金属与二维材料之间的接触特性以及复杂的制造工艺等。为了克服这些问题,人们进行了大量研究,使得器件性能得到了大幅提升。然而,这些研究大多基于复杂的制造工艺,不利于集成度的提高。鉴于此问题,提出了一种基于镜像力势垒降低的水平栅极单层MoS晶体管,其中栅极与源极和漏极处于同一平面,并且获得了与背栅晶体管相当的高达1×10的开关比。随后,通过结合Y函数法(YFM)和所提出的二极管等效模型,验证了肖特基势垒高度降低是导致观察到的源漏电流变化的主要原因。所提出的器件结构不仅为二维器件的高集成度提供了新思路,也为二维材料与金属之间接触特性的研究提供了一定帮助。

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