Fowler Lee, Engqvist Håkan, Öhman-Mägi Caroline
Division of Applied Material Science, Department of Engineering Sciences, The Ångström Laboratory, Uppsala University, Box 534, 751 21 Uppsala, Sweden.
Materials (Basel). 2019 Nov 19;12(22):3798. doi: 10.3390/ma12223798.
In the oral cavity, dental implants-most often made of commercially pure titanium-come in contact with bacteria, and antibacterial management has been researched extensively to improve patient care. With antibiotic resistance becoming increasingly prevalent, this has resulted in copper being investigated as an antibacterial element in alloys. In this study, the objective was to investigate the copper ion concentrations at which cyto-toxicity is avoided while bacterial inhibition is ensured, by comparing Cu ion effects on selected eukaryotes and prokaryotes. To determine relevant copper ion concentrations, ion release rates from copper and a 10 wt. % Cu Ti-alloy were investigated. Survival studies were performed on MC3T3 cells and bacteria, after exposure to Cu ions concentrations ranging from 9 × 10 to 9 × 10 g/mL. Cell survival increased from <10% to >90% after 24 h of exposure, by reducing Cu concentrations from 9 × 10 to 9 × 10 g/mL. Survival of bacteria also increased in the same range of Cu concentrations. The maximum bacteria growth was found at 9 × 10 g/mL, probably due to stress response. In conclusion, the minimum inhibitory concentrations of Cu ions for these prokaryotes and eukaryotes were found in the range from 9 × 10 to 9 × 10 g/mL. Interestingly, the Cu ion concentration correlating to the release rate of the 10 wt. % Cu alloy (9 × 10 g/mL) did not kill the bacteria, although this alloy has previously been found to be antibacterial. Further studies should investigate in depth the bacteria-killing mechanism of copper.
在口腔中，牙种植体（大多由商业纯钛制成）会与细菌接触，人们已对抗菌管理进行了广泛研究，以改善患者护理。随着抗生素耐药性日益普遍，这使得铜作为合金中的抗菌元素受到研究。在本研究中，目标是通过比较铜离子对选定的真核生物和原核生物的影响，来研究既能确保细菌抑制又能避免细胞毒性的铜离子浓度。为了确定相关的铜离子浓度，研究了铜和一种10重量%铜钛合金的离子释放速率。在暴露于浓度范围为9×10至9×10克/毫升的铜离子后，对MC3T3细胞和细菌进行了存活研究。通过将铜浓度从9×10降至9×10克/毫升，暴露24小时后细胞存活率从<10%提高到了>90%。在相同的铜浓度范围内，细菌的存活率也有所提高。在9×10克/毫升时发现细菌生长最多，这可能是由于应激反应。总之，这些原核生物和真核生物的铜离子最小抑菌浓度在9×10至9×10克/毫升范围内。有趣的是，与10重量%铜合金（9×10克/毫升）释放速率相关的铜离子浓度并未杀死细菌，尽管此前已发现这种合金具有抗菌性。进一步的研究应深入探究铜的杀菌机制。
