Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA 22904.
Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, VA 22904.
Proc Natl Acad Sci U S A. 2020 Mar 10;117(10):5210-5216. doi: 10.1073/pnas.2000340117. Epub 2020 Feb 24.
Existing transfer technologies in the construction of film-based electronics and devices are deeply established in the framework of native solid substrates. Here, we report a capillary approach that enables a fast, robust, and reliable transfer of soft films from liquid in a defect-free manner. This capillary transfer is underpinned by the transfer front of dynamic contact among receiver substrate, liquid, and film, and can be well controlled by a selectable motion direction of receiver substrates at a high speed. We demonstrate in extensive experiments, together with theoretical models and computational analysis, the robust capabilities of the capillary transfer using a versatile set of soft films with a broad material diversity of both film and liquid, surface-wetting properties, and complex geometric patterns of soft films onto various solid substrates in a deterministic manner.
现有的基于基底的薄膜电子学和器件的转移技术，深深地根植于原生固态基底的框架中。在此，我们报告了一种可以快速、稳健且可靠地以无缺陷的方式，从液体中转移软薄膜的毛细作用方法。这种毛细转移是基于接收基底、液体和薄膜之间的动态接触的转移前缘，并且可以通过选择接收基底的运动方向，在高速下得到很好的控制。我们通过广泛的实验、理论模型和计算分析，展示了使用多种软薄膜的毛细转移的稳健能力，这些软薄膜具有广泛的材料多样性，包括薄膜和液体、表面润湿性以及复杂的软薄膜几何图案，都可以以确定性的方式转移到各种固体基底上。
