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基于介电泳的碳纳米管定位用于碳纳米管器件的晶圆级制造。

Dielectrophoresis-Based Positioning of Carbon Nanotubes for Wafer-Scale Fabrication of Carbon Nanotube Devices.

作者信息

Kimbrough Joevonte, Williams Lauren, Yuan Qunying, Xiao Zhigang

机构信息

Department of Electrical Engineering and Computer Science, Alabama A&M University, Normal, AL 35762, USA.

Department of Biological and Environmental Science, Alabama A&M University, Normal, AL 35762, USA.

出版信息

Micromachines (Basel). 2020 Dec 25;12(1):12. doi: 10.3390/mi12010012.

DOI:10.3390/mi12010012
PMID:33375602
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7824397/
Abstract

In this paper, we report the wafer-scale fabrication of carbon nanotube field-effect transistors (CNTFETs) with the dielectrophoresis (DEP) method. Semiconducting carbon nanotubes (CNTs) were positioned as the active channel material in the fabrication of carbon nanotube field-effect transistors (CNTFETs) with dielectrophoresis (DEP). The drain-source current (I) was measured as a function of the drain-source voltage (V) and gate-source voltage (V) from each CNTFET on the fabricated wafer. The I on/off ratio was derived for each CNTFET. It was found that 87% of the fabricated CNTFETs was functional, and that among the functional CNTFETs, 30% of the CNTFETs had an I on/off ratio larger than 20 while 70% of the CNTFETs had an I on/off ratio lower than 20. The highest I on/off ratio was about 490. The DEP-based positioning of carbon nanotubes is simple and effective, and the DEP-based device fabrication steps are compatible with Si technology processes and could lead to the wafer-scale fabrication of CNT electronic devices.

摘要

在本文中,我们报告了采用介电泳(DEP)方法在晶圆级制造碳纳米管场效应晶体管(CNTFET)。在利用介电泳(DEP)制造碳纳米管场效应晶体管(CNTFET)的过程中,将半导体碳纳米管(CNT)定位为有源沟道材料。在制造的晶圆上,测量每个CNTFET的漏源电流(I)随漏源电压(V)和栅源电压(V)的变化。得出每个CNTFET的I开/关比。结果发现,所制造的CNTFET中有87%是功能性的,并且在功能性CNTFET中,30%的CNTFET的I开/关比大于20,而70%的CNTFET的I开/关比低于20。最高的I开/关比约为490。基于DEP的碳纳米管定位简单有效,基于DEP的器件制造步骤与硅技术工艺兼容,并可实现CNT电子器件的晶圆级制造。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/281966818139/micromachines-12-00012-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/e104669cca27/micromachines-12-00012-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/64471ddb1b5b/micromachines-12-00012-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/348ed106762b/micromachines-12-00012-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/93bfd72f6205/micromachines-12-00012-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/bf85c45e6f14/micromachines-12-00012-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/c1a121a5ac7d/micromachines-12-00012-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/ede8e0b16f9c/micromachines-12-00012-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/281966818139/micromachines-12-00012-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/e104669cca27/micromachines-12-00012-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/64471ddb1b5b/micromachines-12-00012-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/348ed106762b/micromachines-12-00012-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/93bfd72f6205/micromachines-12-00012-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/bf85c45e6f14/micromachines-12-00012-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/c1a121a5ac7d/micromachines-12-00012-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/ede8e0b16f9c/micromachines-12-00012-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3a6d/7824397/281966818139/micromachines-12-00012-g008.jpg

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Directed Assembly of Liquid Metal-Elastomer Conductors for Stretchable and Self-Healing Electronics.用于可拉伸和自修复电子器件的液态金属-弹性体导体的定向组装
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