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近期含氢键聚合物半导体的结构工程

Recent Structural Engineering of Polymer Semiconductors Incorporating Hydrogen Bonds.

作者信息

Zhang Qi, Huang Jianyao, Wang Kai, Huang Wei

机构信息

Institute of Flexible Electronics (IFE), Northwestern Polytechnical University (NPU), Xi'an, 710072, P. R. China.

CAS key Laboratory of Organic Solids, CAS Research/Education Center for Excellence in Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences, Beijing, 100190, P. R. China.

出版信息

Adv Mater. 2022 Jul;34(26):e2110639. doi: 10.1002/adma.202110639. Epub 2022 Apr 24.

DOI:10.1002/adma.202110639
PMID:35261083
Abstract

Highly planar, extended π-electron organic conjugated polymers have been increasingly attractive for achieving high-mobility organic semiconductors. In addition to the conventional strategy to construct rigid backbone by covalent bonds, hydrogen bond has been employed extensively to increase the planarity and rigidity of polymer via intramolecular noncovalent interactions. This review provides a general summary of high-mobility semiconducting polymers incorporating hydrogen bonds in field-effect transistors over recent years. The structural engineering of the hydrogen bond-containing building blocks and the discussion of theoretical simulation, microstructural characterization, and device performance are covered. Additionally, the effects of the introduction of hydrogen bond on self-healing, stretchability, chemical sensitivity, and mechanical properties are also discussed. The review aims to help and inspire design of new high-mobility conjugated polymers with superiority of mechanical flexibility by incorporation of hydrogen bond for the application in flexible electronics.

摘要

高度平面化、具有扩展π电子的有机共轭聚合物对于实现高迁移率有机半导体越来越具有吸引力。除了通过共价键构建刚性主链的传统策略外,氢键已被广泛用于通过分子内非共价相互作用来提高聚合物的平面度和刚性。本文综述了近年来在场效应晶体管中引入氢键的高迁移率半导体聚合物的概况。涵盖了含氢键结构单元的结构工程以及理论模拟、微观结构表征和器件性能的讨论。此外,还讨论了引入氢键对自修复性、拉伸性、化学敏感性和机械性能的影响。本综述旨在通过引入氢键来帮助和启发设计具有机械柔韧性优势的新型高迁移率共轭聚合物,以应用于柔性电子学领域。

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