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铜掺杂二氧化钛纳米颗粒增强的光催化和光杀菌活性

Enhanced Photocatalytic and Photokilling Activities of Cu-Doped TiO Nanoparticles.

作者信息

Mingmongkol Yumatorn, Trinh Dang Trung Tri, Phuinthiang Patcharaporn, Channei Duangdao, Ratananikom Khakhanang, Nakaruk Auppatham, Khanitchaidecha Wilawan

机构信息

Department of Civil Engineering, Faculty of Engineering, Naresuan University, Phitsanulok 65000, Thailand.

Centre of Excellence for Innovation and Technology for Water Treatment, Faculty of Engineering, Naresuan University, Phitsanulok 65000, Thailand.

出版信息

Nanomaterials (Basel). 2022 Apr 3;12(7):1198. doi: 10.3390/nano12071198.

Abstract

In this work, metal-doped titanium dioxide (TiO) was synthesised with the aim of improving photocatalytic degradation and antimicrobial activities; TiO was doped with copper (Cu) ranging from 0.1 to 1.0 wt%. The physical and chemical properties of the Cu-doped TiO nanoparticles were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), the Brunauer-Emmett-Teller method (BET) and diffuse reflection spectroscopy (DRS). The results revealed that the anatase phase of TiO was maintained well in all the Cu-doped TiO samples. No significant difference in the particle sizes or the specific surface areas was caused by increasing Cu doping. However, the band gap decreased continuously from 3.20 eV for undoped TiO to 3.12 eV for 1.0 wt.% Cu-doped TiO. In addition, the 0.1 wt.% Cu-doped TiO displayed a much greater photocatalytic degradation of methylene blue (MB) and excellent antibacterial ability for () compared to undoped TiO. On the other hand, the high Cu doping levels had negative impacts on the surface charge of nanoparticles and charge transfer for OH• generation, resulting in decreasing MB degradation and photokilling for 1.0 wt.% Cu-doped TiO.

摘要

在这项工作中,合成了金属掺杂的二氧化钛(TiO₂),目的是提高其光催化降解和抗菌活性;TiO₂中掺杂了0.1至1.0 wt%的铜(Cu)。通过X射线衍射(XRD)、透射电子显微镜(TEM)、布鲁诺尔-埃米特-泰勒方法(BET)和漫反射光谱(DRS)对铜掺杂TiO₂纳米颗粒的物理和化学性质进行了表征。结果表明,在所有铜掺杂的TiO₂样品中,TiO₂的锐钛矿相都保持良好。铜掺杂量的增加对粒径或比表面积没有显著影响。然而,带隙从未掺杂TiO₂的3.20 eV持续降低到1.0 wt.%铜掺杂TiO₂的3.12 eV。此外,与未掺杂的TiO₂相比,0.1 wt.%铜掺杂的TiO₂对亚甲基蓝(MB)表现出更大的光催化降解能力,对()具有优异的抗菌能力。另一方面,高铜掺杂水平对纳米颗粒的表面电荷和产生OH•的电荷转移有负面影响,导致1.0 wt.%铜掺杂的TiO₂的MB降解和光杀菌能力下降。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e035/9000674/5860eb6cbe6b/nanomaterials-12-01198-g001.jpg

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