Xia Qiuying, Zan Feng, Zhang Qianyu, Liu Wei, Li Qichanghao, He Yan, Hua Jingyi, Liu Jiahao, Xu Jing, Wang Jinshi, Wu Chuanzhi, Xia Hui
School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing, 210094, China.
Herbert Gleiter Institute of Nanoscience, Nanjing University of Science and Technology, Nanjing, 210094, China.
Adv Mater. 2023 Jan;35(2):e2200538. doi: 10.1002/adma.202200538. Epub 2022 Nov 28.
As the world steps into the era of Internet of Things (IoT), numerous miniaturized electronic devices requiring autonomous micropower sources will be connected to the internet. All-solid-state thin-film lithium/lithium-ion microbatteries (TFBs) combining solid-state battery architecture and thin-film manufacturing are regarded as ideal on-chip power sources for IoT-enabled microelectronic devices. However, unlike commercialized lithium-ion batteries, TFBs are still in the immature state, and new advances in materials, manufacturing, and structure are required to improve their performance. In this review, the current status and existing challenges of TFBs for practical application in internet-connected devices for the IoT are discussed. Recent progress in thin-film deposition, electrode and electrolyte materials, interface modification, and 3D architecture design is comprehensively summarized and discussed, with emphasis on state-of-the-art strategies to improve the areal capacity and cycling stability of TFBs. Moreover, to be suitable power sources for IoT devices, the design of next-generation TFBs should consider multiple functionalities, including wide working temperature range, good flexibility, high transparency, and integration with energy-harvesting systems. Perspectives on designing practically accessible TFBs are provided, which may guide the future development of reliable power sources for IoT devices.
随着世界步入物联网(IoT)时代,众多需要自主微电源的小型化电子设备将接入互联网。结合固态电池架构与薄膜制造技术的全固态薄膜锂/锂离子微型电池(TFBs)被视为支持物联网的微电子设备理想的片上电源。然而,与商业化锂离子电池不同,TFBs仍处于不成熟状态,需要在材料、制造和结构方面取得新进展以提高其性能。在本综述中,讨论了TFBs在物联网互联设备实际应用中的现状和现存挑战。全面总结并讨论了薄膜沉积、电极和电解质材料、界面改性以及三维架构设计方面的最新进展,重点是提高TFBs面积容量和循环稳定性的先进策略。此外,为成为物联网设备适用的电源,下一代TFBs的设计应考虑多种功能,包括宽工作温度范围、良好的柔韧性、高透明度以及与能量收集系统的集成。提供了关于设计实际可用TFBs的观点,这可能会指导物联网设备可靠电源的未来发展。