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对用于装饰和功能性应用的酸性镀铜槽进行脉冲和脉冲反向电镀的系统研究。

A systematic study of pulse and pulse reverse plating on acid copper bath for decorative and functional applications.

作者信息

Mariani Elena, Giurlani Walter, Bonechi Marco, Dell'Aquila Vincenzo, Innocenti Massimo

机构信息

Dipartimento di Chimica, Università degli Studi di Firenze, Via della Lastruccia 3, 50019, Sesto Fiorentino, Italy.

INSTM, Consorzio Interuniversitario Nazionale per la Scienza e Tecnologia dei Materiali, Via G. Giusti 9, 50121, Florence, Italy.

出版信息

Sci Rep. 2022 Oct 28;12(1):18175. doi: 10.1038/s41598-022-22650-x.

DOI:10.1038/s41598-022-22650-x
PMID:36307474
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9616928/
Abstract

Today industrial electroplating is mainly carried out using direct current even if the use of modulated currents could offer greats opportunities. Adjusting the amplitude and length of the current's pulses it is possible to control grain size, porosity and homogeneity of the deposits; the use of modulated currents could also decrease the environmental impact of deposition processes as they require a much lower percentage of organic additives. The aim of this work is to assess, through both theoretical and experimental investigation, how the deposition parameters affect the various characteristics of the deposit. We used a commercial acid copper bath for the depositions performing both pulse and reverse pulse sequences. The coatings have been characterised by estimating the deposition yield, homogeneity, hardness and reflectivity. Using pulsed currents, we obtained shinier and brighter films respect to those produced with stationary currents; the deposition efficiency was also improved. Bipolar currents, on the other hand, favour more homogeneous deposits over the entire deposition area, and are less affected by the edge effect.

摘要

如今,即使调制电流的使用可能带来巨大机遇,但工业电镀主要仍采用直流电进行。通过调整电流脉冲的幅度和长度,可以控制镀层的晶粒尺寸、孔隙率和均匀性;调制电流的使用还可以降低沉积过程对环境的影响,因为它们所需的有机添加剂百分比要低得多。这项工作的目的是通过理论和实验研究来评估沉积参数如何影响镀层的各种特性。我们使用一种商用酸性镀铜槽进行沉积,采用脉冲和反向脉冲序列。通过估算沉积产率、均匀性、硬度和反射率对镀层进行了表征。使用脉冲电流时,与采用稳定电流制备的镀层相比,我们获得了更光亮的薄膜;沉积效率也得到了提高。另一方面,双极电流有利于在整个沉积区域形成更均匀的镀层,并且受边缘效应的影响较小。

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