Lan Linfeng, Ding Chunchun, He Penghui, Su Huimin, Huang Bo, Xu Jintao, Zhang Shuguang, Peng Junbiao
State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China.
School of Physics and Electronics, Hunan University, Changsha 410082, China.
Nanomaterials (Basel). 2022 Nov 4;12(21):3902. doi: 10.3390/nano12213902.
The applications of thin-film transistors (TFTs) based on oxide semiconductors are limited due to instability under negative bias illumination stress (NBIS). Here, we report TFTs based on solution-processed InO semiconductors doped with Pr or Tb, which can effectively improve the NBIS stability. The differences between the Pr-doped InO (Pr:InO) and Tb-doped InO (Tb:InO) are investigated in detail. The undoped InO TFTs with different annealing temperatures exhibit poor NBIS stability with serious turn-on voltage shift (Δ). After doping with Pr/Tb, the TFTs show greatly improved NBIS stability. As the annealing temperature increases, the Pr:InO TFTs have poorer NBIS stability (Δ are -3.2, -4.8, and -4.8 V for annealing temperature of 300, 350, and 400 °C, respectively), while the Tb:InO TFTs have better NBIS stability (Δ are -3.6, -3.6, and -1.2 V for annealing temperature of 300, 350, and 400 ℃, respectively). Further studies reveal that the improvement of the NBIS stability of the Pr/Tb:InO TFTs is attributed to the absorption of the illuminated light by the Pr/Tb4-O2 to Pr/Tb 4-O2 charge transfer (CT) transition and downconversion of the light to nonradiative transition with a relatively short relaxation time compared to the ionization process of the oxygen vacancies. The higher NBIS stability of Tb:InO TFTs compared to Pr:InO TFTs is ascribed to the smaller ion radius of Tb and the lower energy level of Tb 4 with a isotropic half-full configuration compared to that of Pr 4, which would make it easier for the Tb to absorb the visible light than the Pr.
基于氧化物半导体的薄膜晶体管(TFT)的应用由于在负偏压光照应力(NBIS)下的不稳定性而受到限制。在此,我们报道了基于溶液处理的掺杂Pr或Tb的InO半导体的TFT,其可以有效提高NBIS稳定性。详细研究了Pr掺杂的InO(Pr:InO)和Tb掺杂的InO(Tb:InO)之间的差异。具有不同退火温度的未掺杂InO TFT表现出较差的NBIS稳定性,具有严重的开启电压偏移(Δ)。掺杂Pr/Tb后,TFT的NBIS稳定性有了很大提高。随着退火温度的升高,Pr:InO TFT的NBIS稳定性较差(对于300、350和400℃的退火温度,Δ分别为-3.2、-4.8和-4.8 V),而Tb:InO TFT的NBIS稳定性较好(对于300、350和400℃的退火温度,Δ分别为-3.6、-3.6和-1.2 V)。进一步的研究表明,Pr/Tb:InO TFT的NBIS稳定性的提高归因于Pr/Tb4-O2到Pr/Tb 4-O2电荷转移(CT)跃迁对光照的吸收以及与氧空位的电离过程相比具有相对较短弛豫时间的光向下转换为非辐射跃迁。与Pr:InO TFT相比,Tb:InO TFT具有更高的NBIS稳定性归因于Tb的离子半径较小以及与Pr 4相比具有各向同性半满构型的Tb 4的能级较低,这使得Tb比Pr更容易吸收可见光。