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BOE 溶液中熔融石英玻璃微结构的深层多级湿法刻蚀。

Deep multilevel wet etching of fused silica glass microstructures in BOE solution.

机构信息

FMN Laboratory, Bauman Moscow State Technical University, Moscow, 105005, Russia.

Dukhov Automatics Research Institute, VNIIA, Moscow, 127030, Russia.

出版信息

Sci Rep. 2023 Mar 30;13(1):5228. doi: 10.1038/s41598-023-32503-w.

DOI:10.1038/s41598-023-32503-w
PMID:36997654
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10063648/
Abstract

Fused silica glass is a material of choice for micromechanical, microfluidic, and optical devices due to its chemical resistance, optical, electrical, and mechanical performance. Wet etching is the key method for fabricating of such microdevices. Protective mask integrity is a big challenge due extremely aggressive properties of etching solution. Here, we propose multilevel microstructures fabrication route based on fused silica deep etching through a stepped mask. First, we provide an analysis of a fused silica dissolution mechanism in buffered oxide etching (BOE) solution and calculate the main fluoride fractions like [Formula: see text], [Formula: see text], [Formula: see text] as a function of pH and NHF:HF ratio. Then, we experimentally investigate the influence of BOE composition (1:1-14:1) on the mask resistance, etch rate and profile isotropy during deep etching through a metal/photoresist mask. Finally, we demonstrate a high-quality multilevel over-200 μm etching process with the rate up to 3 μm/min, which could be of a great interest for advanced microdevices with flexure suspensions, inertial masses, microchannels, and through-wafer holes.

摘要

熔融石英玻璃由于其化学抗性、光学、电学和机械性能，是微机械、微流控和光学器件的首选材料。湿法刻蚀是制造此类微器件的关键方法。由于蚀刻溶液的极强腐蚀性，保护掩模的完整性是一个巨大的挑战。在这里，我们提出了一种基于熔融石英深蚀刻的多级微结构制造方法，通过阶梯掩模进行。首先，我们分析了在缓冲氧化物蚀刻（BOE）溶液中熔融石英的溶解机制，并计算了主要的氟化物分数，如[公式：见文本]、[公式：见文本]、[公式：见文本]，作为 pH 和 NHF:HF 比的函数。然后，我们通过金属/光刻胶掩模实验研究了 BOE 组成（1:1-14:1）对深蚀刻过程中掩模电阻、蚀刻速率和各向同性的影响。最后，我们展示了一种高质量的多级超过 200 μm 的蚀刻工艺，其速率高达 3 μm/min，这对于具有挠曲悬架、惯性质量、微通道和贯穿晶圆孔的先进微器件具有重要意义。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/ff3fa070c5f8/41598_2023_32503_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/379ec351580c/41598_2023_32503_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/955fffb3fa61/41598_2023_32503_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/e6d4e7795424/41598_2023_32503_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/64dab754cf52/41598_2023_32503_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/a2688052e437/41598_2023_32503_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/6232a8d36f9f/41598_2023_32503_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/ff3fa070c5f8/41598_2023_32503_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/379ec351580c/41598_2023_32503_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/955fffb3fa61/41598_2023_32503_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/e6d4e7795424/41598_2023_32503_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/64dab754cf52/41598_2023_32503_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/a2688052e437/41598_2023_32503_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/6232a8d36f9f/41598_2023_32503_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4fec/10063648/ff3fa070c5f8/41598_2023_32503_Fig7_HTML.jpg

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