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在无孪晶界的Cu(111)衬底上可控生长单晶石墨烯晶圆

Controlled Growth of Single-Crystal Graphene Wafers on Twin-Boundary-Free Cu(111) Substrates.

作者信息

Zhu Yeshu, Zhang Jincan, Cheng Ting, Tang Jilin, Duan Hongwei, Hu Zhaoning, Shao Jiaxin, Wang Shiwei, Wei Mingyue, Wu Haotian, Li Ang, Li Sheng, Balci Osman, Shinde Sachin M, Ramezani Hamideh, Wang Luda, Lin Li, Ferrari Andrea C, Yakobson Boris I, Peng Hailin, Jia Kaicheng, Liu Zhongfan

机构信息

Center for Nanochemistry, Beijing Science and Engineering Center for Nanocarbons, Beijing National Laboratory for Molecular Science, College of Chemistry and Molecular Engineering, Peking University, Beijing, 100871, P. R. China.

Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, 100871, P. R. China.

出版信息

Adv Mater. 2024 Apr;36(17):e2308802. doi: 10.1002/adma.202308802. Epub 2023 Nov 29.

Abstract

Single-crystal graphene (SCG) wafers are needed to enable mass-electronics and optoelectronics owing to their excellent properties and compatibility with silicon-based technology. Controlled synthesis of high-quality SCG wafers can be done exploiting single-crystal Cu(111) substrates as epitaxial growth substrates recently. However, current Cu(111) films prepared by magnetron sputtering on single-crystal sapphire wafers still suffer from in-plane twin boundaries, which degrade the SCG chemical vapor deposition. Here, it is shown how to eliminate twin boundaries on Cu and achieve 4 in. Cu(111) wafers with ≈95% crystallinity. The introduction of a temperature gradient on Cu films with designed texture during annealing drives abnormal grain growth across the whole Cu wafer. In-plane twin boundaries are eliminated via migration of out-of-plane grain boundaries. SCG wafers grown on the resulting single-crystal Cu(111) substrates exhibit improved crystallinity with >97% aligned graphene domains. As-synthesized SCG wafers exhibit an average carrier mobility up to 7284 cm V s at room temperature from 103 devices and a uniform sheet resistance with only 5% deviation in 4 in. region.

摘要

由于其优异的性能以及与硅基技术的兼容性,单晶石墨烯(SCG)晶圆对于实现大规模电子和光电子器件至关重要。最近,可以利用单晶Cu(111)衬底作为外延生长衬底来实现高质量SCG晶圆的可控合成。然而,目前通过磁控溅射在单晶蓝宝石晶圆上制备的Cu(111)薄膜仍然存在面内孪晶界,这会降低SCG化学气相沉积的质量。在此,展示了如何消除Cu上的孪晶界并获得结晶度约为95%的4英寸Cu(111)晶圆。在退火过程中,对具有特定织构的Cu薄膜引入温度梯度,可驱动整个Cu晶圆上的异常晶粒生长。通过面外晶界的迁移消除面内孪晶界。在所得单晶Cu(111)衬底上生长的SCG晶圆表现出更高的结晶度,其石墨烯畴的取向度大于97%。从103个器件测得,合成的SCG晶圆在室温下平均载流子迁移率高达7284 cm² V⁻¹ s⁻¹,并且在4英寸区域内具有均匀的薄层电阻,偏差仅为5%。

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