Han Tielong, Hou Chao, Zhao Zhi, Jiao Zengbao, Li Yurong, Jiang Shuang, Lu Hao, Wang Haibin, Liu Xuemei, Nie Zuoren, Song Xiaoyan
College of Materials Science and Engineering, Key Laboratory of Advanced Functional Materials, Ministry of Education of China, Beijing University of Technology, Beijing, China.
Department of Mechanical Engineering, The Hong Kong Polytechnic University, Hong Kong, China.
Nat Commun. 2024 Feb 29;15(1):1863. doi: 10.1038/s41467-024-46029-w.
Simultaneous improvement of strength and conductivity is urgently demanded but challenging for bimetallic materials. Here we show by creating a self-assembled lamellar (SAL) architecture in W-Cu system, enhancement in strength and electrical conductivity is able to be achieved at the same time. The SAL architecture features alternately stacked Cu layers and W lamellae containing high-density dislocations. This unique layout not only enables predominant stress partitioning in the W phase, but also promotes hetero-deformation induced strengthening. In addition, the SAL architecture possesses strong crack-buffering effect and damage tolerance. Meanwhile, it provides continuous conducting channels for electrons and reduces interface scattering. As a result, a yield strength that doubles the value of the counterpart, an increased electrical conductivity, and a large plasticity were achieved simultaneously in the SAL W-Cu composite. This study proposes a flexible strategy of architecture design and an effective method for manufacturing bimetallic composites with excellent integrated properties.
双金属材料急需同时提高强度和导电性，但这具有挑战性。在此，我们表明通过在W-Cu体系中创建自组装层状（SAL）结构，能够同时实现强度和导电性的增强。SAL结构的特点是交替堆叠的Cu层和含有高密度位错的W薄片。这种独特的布局不仅能使W相中的应力分配占主导地位，还能促进异质变形诱导强化。此外，SAL结构具有很强的裂纹缓冲效应和损伤容限。同时，它为电子提供了连续的传导通道，并减少了界面散射。结果，SAL W-Cu复合材料同时实现了屈服强度加倍、导电性提高以及较大的塑性。本研究提出了一种灵活的结构设计策略和一种制造具有优异综合性能的双金属复合材料的有效方法。
