Department of Mechanical Engineering, College of Engineering, Shantou University, Shantou, 515063, China.
Intelligent Manufacturing Key Laboratory of Ministry of Education, Shantou University, Shantou, 515063, China.
Sci Rep. 2024 Sep 3;14(1):20420. doi: 10.1038/s41598-024-69222-9.
Injection molding is a common plastic processing technique that allows melted plastic to be injected into a mold through pressure to form differently shaped plastic parts. In injection molding, in-mold electronics (IME) can include various circuit components, such as sensors, amplifiers, and filters. These components can be injected into the mold to form a whole within the melted plastic and can therefore be very easily integrated into the molded part. The brain-computer interface (BCI) is a direct connection pathway between a human or animal brain and an external device. Through BCIs, individuals can use their own brain signals to control these components, enabling more natural and intuitive interactions. In addition, brain-computer interfaces can also be used to assist in medical treatments, such as controlling prosthetic limbs or helping paralyzed patients regain mobility. Brain-computer interfaces can be realized in two ways: invasively and noninvasively, and in this paper, we adopt a noninvasive approach. First, a helmet model is designed according to head shape, and second, a printed circuit film is made to receive EEG signals and an IME injection mold for the helmet plastic parts. In the electronic film, conductive ink is printed to connect each component. However, improper parameterization during the injection molding process can lead to node displacements and residual stress changes in the molded part, which can damage the circuits in the electronic film and affect its performance. Therefore, in this paper, the use of the BCI molding process to ensure that the node displacement reaches the optimal value is studied. Second, the multistrategy differential evolutionary algorithm is used to optimize the injection molding parameters in the process of brain-computer interface formation. The relationship between the injection molding parameters and the actual target value is investigated through Latin hypercubic sampling, and the optimized parameters are compared with the target parameters to obtain the optimal parameter combination. Under the optimal parameters, the node displacement can be optimized from 0.585 to 0.027 mm, and the optimization rate can reach 95.38%. Ultimately, by detecting whether the voltage difference between the output inputs is within the permissible range, the reliability of the brain-computer interface after node displacement optimization can be evaluated.
注塑成型是一种常见的塑料加工技术,它通过压力将熔化的塑料注入模具中,形成不同形状的塑料零件。在注塑成型中,模内电子(IME)可以包括各种电路元件,如传感器、放大器和滤波器。这些元件可以注入模具中,与熔化的塑料形成整体,因此可以非常容易地集成到成型部件中。脑机接口(BCI)是大脑与外部设备之间的直接连接途径。通过 BCI,个体可以使用自己的脑信号来控制这些元件,实现更自然和直观的交互。此外,脑机接口还可用于医疗治疗,如控制假肢或帮助瘫痪患者恢复运动能力。脑机接口可以通过两种方式实现:侵入式和非侵入式,本文采用非侵入式方法。首先,根据头型设计头盔模型,然后制作印刷电路板薄膜以接收 EEG 信号和用于头盔塑料零件的 IME 注塑模具。在电子薄膜中,印刷导电油墨以连接每个元件。然而,注塑成型过程中的参数不当会导致成型部件中的节点位移和残余应力变化,从而损坏电子薄膜中的电路并影响其性能。因此,本文研究了使用 BCI 成型工艺来确保节点位移达到最佳值。其次,使用多策略差分进化算法优化脑机接口形成过程中的注塑成型参数。通过拉丁超立方采样研究注塑成型参数与实际目标值之间的关系,并将优化后的参数与目标参数进行比较,得到最佳参数组合。在最佳参数下,节点位移可以从 0.585 优化到 0.027mm,优化率可达 95.38%。最终,通过检测输出输入之间的电压差是否在允许范围内,可以评估节点位移优化后的脑机接口的可靠性。