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铁镍基多层磁阻抗元件中静磁相互作用的影响

Effects of Magnetostatic Interactions in FeNi-Based Multilayered Magnetoimpedance Elements.

作者信息

Melnikov Grigory Yu, Komogortsev Sergey V, Svalov Andrey V, Gorchakovskiy Alexander A, Vazhenina Irina G, Kurlyandskaya Galina V

机构信息

Institute of Natural Sciences and Mathematics, Ural Federal University, 620002 Ekaterinburg, Russia.

Kirensky Institute of Physics, Federal Research Center SB RAS, 660036 Krasnoyarsk, Russia.

出版信息

Sensors (Basel). 2024 Sep 29;24(19):6308. doi: 10.3390/s24196308.

Abstract

Multilayered [Cu(3 nm)/FeNi(100 nm)]/Cu(150 nm)/FeNi(10 nm)/Cu(150 nm)/FeNi(10 nm)/Cu(150 nm)/[Cu(3 nm)/FeNi(100 nm)] structures were obtained by using the magnetron sputtering technique in the external in-plane magnetic field. From these, multilayer magnetoimpedance elements were fabricated in the shape of elongated stripes using the lift-off lithographic process. In order to obtain maximum magnetoimpedance (MI) sensitivity with respect to the external magnetic field, the short side of the rectangular element was oriented along the direction of the technological magnetic field applied during the multilayered structure deposition. MI sensitivity was defined as the change of the total impedance or its real part per unit of the magnetic field. The design of the elements (multilayered structure, shape of the element, etc.) contributed to the dynamic and static magnetic properties. The magnetostatic properties of the MI elements, including analysis of the magnetic domain structure, indicated the crucial importance of magnetostatic interactions between FeNi magnetic layers in the analyzed [Cu(3 nm)/FeNi(100 nm)] multilayers. In addition, the uniformity of the magnetic parameters was defined by the advanced technique of the local measurements of the ferromagnetic resonance field. Dynamic methods allowed investigation of the elements at different thicknesses by varying the frequency of the electromagnetic excitation. The maximum sensitivity of 40%/Oe with respect to the applied field in the range of the fields of 3 Oe to 5 Oe is promising for different applications.

摘要

采用磁控溅射技术,在面外磁场中制备了多层[Cu(3nm)/FeNi(100nm)]/Cu(150nm)/FeNi(10nm)/Cu(150nm)/FeNi(10nm)/Cu(150nm)/[Cu(3nm)/FeNi(100nm)]结构。利用剥离光刻工艺,将这些多层结构制成细长条纹形状的多层磁阻抗元件。为了获得相对于外部磁场的最大磁阻抗(MI)灵敏度,矩形元件的短边沿多层结构沉积过程中施加的工艺磁场方向取向。MI灵敏度定义为总阻抗或其实部随磁场单位变化的量。元件的设计(多层结构、元件形状等)对动态和静态磁性能有影响。MI元件的静磁特性,包括磁畴结构分析,表明在分析的[Cu(3nm)/FeNi(100nm)]多层中,FeNi磁性层之间的静磁相互作用至关重要。此外,通过铁磁共振场的局部测量先进技术定义了磁参数的均匀性。动态方法允许通过改变电磁激励频率来研究不同厚度的元件。在3 Oe至5 Oe的磁场范围内,相对于施加磁场的最大灵敏度为40%/Oe,这对不同应用很有前景。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/620b/11479168/faf2a13c6361/sensors-24-06308-g001.jpg

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