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用于长保留时间2T0C DRAM的具有最小寄生电容的基于ITZO的自对准顶栅薄膜晶体管。

ITZO-Based Self-Aligned Top Gate Thin-Film Transistor with Minimum Parasitic Capacitance for Long-Retention 2T0C DRAM.

作者信息

Park Jeong-Min, Lee Sein, Lee Junseo, Kwon Jang-Yeon

机构信息

School of Integrated Technology, Yonsei University, Seoul 03722, Republic of Korea.

BK21 Graduate Program in Intelligent Semiconductor Technology, Yonsei University, Incheon 21983, South Korea.

出版信息

ACS Omega. 2024 Dec 31;10(1):1006-1011. doi: 10.1021/acsomega.4c08274. eCollection 2025 Jan 14.

DOI:10.1021/acsomega.4c08274
PMID:39829566
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11739972/
Abstract

We developed a two-transistor, zero-capacitor (2T0C) gain-cell memory featuring a self-aligned top-gate-structured thin-film transistor (TFT) for the first time. The proposed indium tin zinc oxide (ITZO) channel-incorporated architecture was specifically engineered to minimize parasitic capacitance for achieving long-retention 2T0C memory operations. A typical 2T0C structure features five types of parasitic capacitances; however, the proposed SATG design effectively used an essential gate insulator capacitance ( ) and reduced four nonessential capacitances ( , , , and ) to virtually zero. The ITZO-based 2T0C gain-cell memory achieved a retention time >10,000 s owing to the extremely low off-current (2.33 × 10 A/μm), superior positive-bias stability (0.71 V), and high saturation mobility [17.52 cm/(V s)] of the optimized TFT structure. Our proposed memory with long retention and high endurance is a promising solution for next-generation 3D-integrated stacked dynamic random-access memories and defines a new structural standard for future memory architectures.

摘要

我们首次开发了一种具有自对准顶栅结构薄膜晶体管(TFT)的双晶体管零电容(2T0C)增益单元存储器。所提出的包含铟锡氧化锌(ITZO)沟道的架构经过专门设计,以最小化寄生电容,从而实现长保持时间的2T0C存储器操作。典型的2T0C结构具有五种类型的寄生电容;然而,所提出的自对准顶栅(SATG)设计有效地利用了基本的栅极绝缘层电容( ),并将四种非必要电容( 、 、 和 )降低到几乎为零。基于ITZO的2T0C增益单元存储器由于优化的TFT结构具有极低的关态电流(2.33×10 A/μm)、优异的正偏压稳定性(0.71 V)和高饱和迁移率[17.52 cm²/(V·s)],实现了大于1万秒的保持时间。我们提出的具有长保持时间和高耐久性的存储器是下一代3D集成堆叠动态随机存取存储器的一种有前途的解决方案,并为未来的存储器架构定义了一种新的结构标准。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e7c/11739972/dce06c51d163/ao4c08274_0004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e7c/11739972/78d9def7e3c5/ao4c08274_0001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e7c/11739972/160b33fdeb55/ao4c08274_0002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e7c/11739972/2efaec7a952a/ao4c08274_0003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e7c/11739972/dce06c51d163/ao4c08274_0004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e7c/11739972/78d9def7e3c5/ao4c08274_0001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e7c/11739972/160b33fdeb55/ao4c08274_0002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e7c/11739972/2efaec7a952a/ao4c08274_0003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e7c/11739972/dce06c51d163/ao4c08274_0004.jpg

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本文引用的文献

1
Amorphous oxide semiconductor for monolithic 3D DRAM: an enabler or passer-by?用于单片3D DRAM的非晶氧化物半导体:推动者还是过客?
Natl Sci Rev. 2023 Nov 21;11(3):nwad290. doi: 10.1093/nsr/nwad290. eCollection 2024 Mar.
2
True Nonvolatile High-Speed DRAM Cells Using Tailored Ultrathin IGZO.采用定制超薄铟镓锌氧化物的真非易失性高速动态随机存取存储器单元
Adv Mater. 2023 May;35(20):e2210554. doi: 10.1002/adma.202210554. Epub 2023 Mar 31.