Nguyen Clark T C
Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor 48109-2122, USA.
IEEE Trans Ultrason Ferroelectr Freq Control. 2007 Feb;54(2):251-70. doi: 10.1109/tuffc.2007.240.
An overview on the use of microelectromechanical systems (MEMS) technologies for timing and frequency control is presented. In particular, micromechanical RF filters and reference oscillators based on recently demonstrated vibrating on-chip micromechanical resonators with Q's > 10,000 at 1.5 GHz are described as an attractive solution to the increasing count of RF components (e.g., filters) expected to be needed by future multiband, multimode wireless devices. With Q's this high in on-chip abundance, such devices might also enable a paradigm shift in the design of timing and frequency control functions, where the advantages of high-Q are emphasized, rather than suppressed (e.g., due to size and cost reasons), resulting in enhanced robustness and power savings. Indeed, as vibrating RF MEMS devices are perceived more as circuit building blocks than as stand-alone devices, and as the frequency processing circuits they enable become larger and more complex, the makings of an integrated micromechanical circuit technology begin to take shape, perhaps with a functional breadth not unlike that of integrated transistor circuits. With even more aggressive three-dimensional MEMS technologies, even higher on-chip Q's are possible, such as already achieved via chip-scale atomic physics packages, which so far have achieved Q's > 10(7) using atomic cells measuring only 10 mm3 in volume and consuming just 5 mW of power, all while still allowing atomic clock Allan deviations down to 10(-11) at one hour.
本文介绍了微机电系统(MEMS)技术在定时和频率控制方面的应用概况。特别地,基于最近展示的在1.5GHz频率下品质因数Q>10000的片上振动微机械谐振器的微机械射频滤波器和参考振荡器,被描述为未来多频段、多模式无线设备所需射频组件(如滤波器)数量不断增加的一种有吸引力的解决方案。由于片上具有如此高的品质因数,此类设备还可能使定时和频率控制功能的设计发生范式转变,即强调高Q值的优势,而非抑制它(例如由于尺寸和成本原因),从而提高鲁棒性并节省功耗。实际上,随着振动射频MEMS器件更多地被视为电路构建模块而非独立设备,以及它们所支持的频率处理电路变得更大、更复杂,集成微机械电路技术的雏形开始显现,其功能广度或许与集成晶体管电路并无二致。采用更先进的三维MEMS技术,有可能实现更高的片上品质因数,例如通过芯片级原子物理封装已经实现了这样的成果,目前通过体积仅为10mm3且功耗仅为5mW的原子单元已实现品质因数Q>10(7),同时仍能使原子钟在一小时内的阿伦偏差降至10(-11)。