Park Se-Chul, Fang Jun, Biswas Shantonu, Mozafari Mahsa, Stauden Thomas, Jacobs Heiko O
University of Minnesota, Electrical and Computer Engineering, Rm. 4-178, 200 Union St. SE, Minneapolis, MN, 55455, USA.
Adv Mater. 2014 Sep 10;26(34):5942-9. doi: 10.1002/adma.201401573. Epub 2014 Jun 27.
A first automated reel-to-reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high-speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm-wide web) over large-area substrates. The optimization of the system (>99% assembly yield) is based on identification, calculation, and optimization of the relevant forces. As an application, the production of a solid-state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.
报道了一种用于宏观电子应用的首个自动化卷对卷流体自组装工艺。该系统能够在大面积基板上高速组装半导体芯片（使用2.5厘米宽的卷材时每小时可组装15000个芯片）。该系统的优化（组装良率>99%）基于对相关力的识别、计算和优化。作为一个应用实例，讨论了固态照明面板的生产，其中涉及一种通过层压施加导电层的新方法。
