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锗中锡的非平衡诱导:迈向直接带隙Ge(1-x)Sn(x)纳米线

Non-equilibrium induction of tin in germanium: towards direct bandgap Ge(1-x)Sn(x) nanowires.

作者信息

Biswas Subhajit, Doherty Jessica, Saladukha Dzianis, Ramasse Quentin, Majumdar Dipanwita, Upmanyu Moneesh, Singha Achintya, Ochalski Tomasz, Morris Michael A, Holmes Justin D

机构信息

Materials Chemistry &Analysis Group, Department of Chemistry, Tyndall National Institute, University College Cork, Cork T12 YF78, Ireland.

Department of Photonics, Tyndall National Institute, University College Cork, Cork T12 R5CP, Ireland.

出版信息

Nat Commun. 2016 Apr 20;7:11405. doi: 10.1038/ncomms11405.

Abstract

The development of non-equilibrium group IV nanoscale alloys is critical to achieving new functionalities, such as the formation of a direct bandgap in a conventional indirect bandgap elemental semiconductor. Here, we describe the fabrication of uniform diameter, direct bandgap Ge(1-x)Sn(x) alloy nanowires, with a Sn incorporation up to 9.2 at.%, far in excess of the equilibrium solubility of Sn in bulk Ge, through a conventional catalytic bottom-up growth paradigm using noble metal and metal alloy catalysts. Metal alloy catalysts permitted a greater inclusion of Sn in Ge nanowires compared with conventional Au catalysts, when used during vapour-liquid-solid growth. The addition of an annealing step close to the Ge-Sn eutectic temperature (230 °C) during cool-down, further facilitated the excessive dissolution of Sn in the nanowires. Sn was distributed throughout the Ge nanowire lattice with no metallic Sn segregation or precipitation at the surface or within the bulk of the nanowires. The non-equilibrium incorporation of Sn into the Ge nanowires can be understood in terms of a kinetic trapping model for impurity incorporation at the triple-phase boundary during growth.

摘要

非平衡IV族纳米级合金的发展对于实现新功能至关重要,例如在传统的间接带隙元素半导体中形成直接带隙。在此,我们描述了通过使用贵金属和金属合金催化剂的传统催化自下而上生长模式,制备直径均匀、具有直接带隙的Ge(1-x)Sn(x)合金纳米线,其中Sn的掺入量高达9.2原子%,远远超过Sn在块状Ge中的平衡溶解度。与传统的Au催化剂相比,在气-液-固生长过程中使用金属合金催化剂时,Ge纳米线中能够掺入更多的Sn。在冷却过程中,添加接近Ge-Sn共晶温度(230°C)的退火步骤,进一步促进了Sn在纳米线中的过度溶解。Sn分布在整个Ge纳米线晶格中,在纳米线的表面或内部没有金属Sn的偏析或沉淀。Sn在Ge纳米线中的非平衡掺入可以通过生长过程中杂质在三相边界处掺入的动力学捕获模型来理解。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9ca5/4843103/a1b5f95d0f75/ncomms11405-f1.jpg

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