Lee Hao, Deshmukh Sanchit, Wen Jing, Costa Viviane Z, Schuder Joachim S, Sanchez Michael, Ichimura Andrew S, Pop Eric, Wang Bin, Newaz A K M
School of Chemical, Biological and Materials Engineering , University of Oklahoma , Norman , Oklahoma 73019 , United States.
Key Laboratory for Photonic and Electronic Bandgap Materials, Ministry of Education, School of Physics and Electronic Engineering , Harbin Normal University , Harbin 150025 , P. R. China.
ACS Appl Mater Interfaces. 2019 Aug 28;11(34):31543-31550. doi: 10.1021/acsami.9b09868. Epub 2019 Aug 19.
Layered materials based on transition-metal dichalcogenides (TMDs) are promising for a wide range of electronic and optoelectronic devices. Realizing such practical applications often requires metal-TMD connections or contacts. Hence, a complete understanding of electronic band alignments and potential barrier heights governing the transport through metal-TMD junctions is critical. However, it is presently unclear how the energy bands of a TMD align while in contact with a metal as a function of the number of layers. In pursuit of removing this knowledge gap, we have performed conductive atomic force microscopy (CAFM) of few-layered (1 to 5 layers) MoS immobilized on ultraflat conducting Au surfaces [root-mean-square (rms) surface roughness < 0.2 nm] and indium-tin oxide (ITO) substrates (rms surface roughness < 0.7 nm) forming a vertical metal (CAFM tip)-semiconductor-metal device. We have observed that the current increases with the number of layers up to five layers. By applying Fowler-Nordheim tunneling theory, we have determined the barrier heights for different layers and observed how this barrier decreases as the number of layers increases. Using density functional theory calculations, we successfully demonstrated that the barrier height decreases as the layer number increases. By illuminating TMDs on a transparent ultraflat conducting ITO substrate, we observed a reduction in current when compared to the current measured in the dark, hence demonstrating negative photoconductivity. Our study provides a fundamental understanding of the local electronic and optoelectronic behaviors of the TMD-metal junction, which depends on the numbers of TMD layers and may pave an avenue toward developing nanoscale electronic devices with tailored layer-dependent transport properties.
基于过渡金属二硫属化物(TMDs)的层状材料在广泛的电子和光电器件领域具有广阔前景。要实现这些实际应用,通常需要金属与TMD的连接或接触。因此,全面了解控制金属-TMD结传输的电子能带排列和势垒高度至关重要。然而,目前尚不清楚TMD与金属接触时的能带如何随层数变化。为填补这一知识空白,我们对固定在超平导电金表面(均方根(rms)表面粗糙度<0.2 nm)和氧化铟锡(ITO)衬底(rms表面粗糙度<0.7 nm)上的少层(1至5层)MoS₂进行了导电原子力显微镜(CAFM)研究,形成垂直金属(CAFM探针)-半导体-金属器件。我们观察到电流随层数增加直至五层而增大。通过应用福勒-诺德海姆隧穿理论,我们确定了不同层数的势垒高度,并观察到该势垒如何随层数增加而降低。利用密度泛函理论计算,我们成功证明了势垒高度随层数增加而降低。通过在透明超平导电ITO衬底上照射TMD,我们观察到与在黑暗中测量的电流相比电流减小,从而证明了负光电导性。我们的研究提供了对TMD-金属结局部电子和光电行为的基本理解,这种行为取决于TMD层数,并可能为开发具有定制层依赖传输特性的纳米级电子器件铺平道路。