Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China.
School of Material Science and Engineering, University of Science and Technology of China, Anhui, 230026, China.
Nat Commun. 2020 Mar 5;11(1):1205. doi: 10.1038/s41467-020-15096-0.
Since its invention in the 1960s, one of the most significant evolutions of metal-oxide-semiconductor field effect transistors (MOS-FETs) would be the three dimensionalized version that makes the semiconducting channel vertically wrapped by conformal gate electrodes, also recognized as FinFET. During the past decades, the width of fin (W[Formula: see text]) in FinFETs has shrunk from about 150 nm to a few nanometers. However, W[Formula: see text] seems to have been levelling off in recent years, owing to the limitation of lithography precision. Here, we show that by adapting a template-growth method, different types of mono-layered two-dimensional crystals are isolated in a vertical manner. Based on this, FinFETs with one atomic layer fin are obtained, with on/off ratios reaching [Formula: see text]. Our findings push the FinFET to the sub 1 nm fin-width limit, and may shed light on the next generation nanoelectronics for higher integration and lower power consumption.
自 20 世纪 60 年代发明以来,金属氧化物半导体场效应晶体管 (MOSFET) 的最重要发展之一是三维版本,它使半导体沟道被共形栅电极垂直包围,也被称为 FinFET。在过去的几十年中,FinFET 中的鳍片宽度 (W[Formula: see text]) 已从约 150nm 缩小到几纳米。然而,由于光刻精度的限制,近年来 W[Formula: see text]似乎已经达到了稳定状态。在这里,我们展示了通过采用模板生长方法,可以垂直地分离出不同类型的单层二维晶体。基于此,获得了 FinFET 具有一个原子层的鳍片,其导通/关断比达到[Formula: see text]。我们的发现将 FinFET 推向了亚 1nm 鳍片宽度的极限,并可能为下一代更高集成度和更低功耗的纳米电子学提供启示。