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用于近红外光电探测器的硅基单层石墨烯的合成

synthesis of monolayer graphene on silicon for near-infrared photodetectors.

作者信息

Xiang Pengcheng, Wang Gang, Yang Siwei, Liu Zhiduo, Zheng Li, Li Jiurong, Xu Anli, Zhao Menghan, Zhu Wei, Guo Qinglei, Chen Da

机构信息

Department of Microelectronic Science and Engineering, School of Physical Science and Technology, Ningbo University Ningbo 315211 P. R. China

State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology Shanghai 200500 P. R. China.

出版信息

RSC Adv. 2019 Nov 18;9(64):37512-37517. doi: 10.1039/c9ra06792b. eCollection 2019 Nov 13.

Abstract

Direct integration of monolayer graphene on a silicon (Si) substrate is realized by a simple thermal annealing process, involving a top copper (Cu) layer as the catalyst and an inserted polymethylmethacrylate (PMMA) as the carbon source. After spin-coating the PMMA carbon source on the Si substrate, the Cu catalyst was deposited on PMMA/Si by electron beam evaporation. After that, graphene was directly synthesized on Si by decomposition and dehydrogenation of PMMA and the catalyzation effect of Cu under a simple thermal annealing process. Furthermore, under an optimized growth condition, monolayer graphene directly formed on the Si substrate was demonstrated. Utilizing the as-grown graphene/Si heterojunction, near-infrared photodetectors with high detectivity (∼1.1 × 10 cm Hz W) and high responsivity (50 mA W) at 1550 nm were directly fabricated without any post-transfer process. The proposed approach for directly growing graphene on silicon is highly scalable and compatible with present nano/micro-fabrication systems, thus promoting the application of graphene in microelectronic fields.

摘要

通过简单的热退火工艺实现了单层石墨烯在硅(Si)衬底上的直接集成,该工艺涉及顶部铜(Cu)层作为催化剂以及插入的聚甲基丙烯酸甲酯(PMMA)作为碳源。在Si衬底上旋涂PMMA碳源后,通过电子束蒸发将Cu催化剂沉积在PMMA/Si上。之后,在简单的热退火工艺下,通过PMMA的分解和脱氢以及Cu的催化作用,在Si上直接合成了石墨烯。此外,在优化的生长条件下,展示了在Si衬底上直接形成的单层石墨烯。利用生长的石墨烯/Si异质结,无需任何后转移工艺,直接制备了在1550 nm处具有高探测率(约1.1×10 cm Hz W)和高响应度(50 mA W)的近红外光电探测器。所提出的在硅上直接生长石墨烯的方法具有高度可扩展性,并且与现有的纳米/微制造系统兼容,从而推动了石墨烯在微电子领域的应用。

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