Sharma Ekta, Rathi Reena, Misharwal Jaya, Sinhmar Bhavya, Kumari Suman, Dalal Jasvir, Kumar Anand
Deaprtment of Physics, Chaudhary Ranbir Singh University, Jind 126102, India.
Department of Physics, Maharani Kishori Jat Kanya Mahavidyalaya, Rohtak 124001, India.
Nanomaterials (Basel). 2022 Aug 11;12(16):2754. doi: 10.3390/nano12162754.
In this era, electronic devices such as mobile phones, computers, laptops, sensors, and many more have become a necessity in healthcare, for a pleasant lifestyle, and for carrying out tasks quickly and easily. Different types of temperature sensors, biosensors, photosensors, etc., have been developed to meet the necessities of people. All these devices have chips inside them fabricated using diodes, transistors, logic gates, and ICs. The patterning of the substrate which is used for the further development of these devices is done with the help of a technique known as lithography. In the present work, we have carried out a review on different types of lithographic techniques such as optical lithography, extreme ultraviolet lithography, electron beam lithography, X-ray lithography, and ion beam lithography. The evolution of these techniques with time and their application in device fabrication are discussed. The different exposure tools developed in the past decade to enhance the resolution of these devices are also discussed. Chemically amplified and non-chemically amplified resists with their bonding and thickness are discussed. Mask and maskless lithography techniques are discussed along with their merits and demerits. Device fabrication at micro and nano scale has been discussed. Advancements that can be made to improve the performance of these techniques are also suggested.
在这个时代,诸如手机、电脑、笔记本电脑、传感器等电子设备已成为医疗保健、实现愉悦生活方式以及快速轻松完成任务的必需品。为满足人们的需求,已开发出不同类型的温度传感器、生物传感器、光传感器等。所有这些设备内部都有使用二极管、晶体管、逻辑门和集成电路制造的芯片。用于这些设备进一步开发的基板图案化是借助一种称为光刻的技术完成的。在本工作中,我们对不同类型的光刻技术进行了综述,如光学光刻、极紫外光刻、电子束光刻、X射线光刻和离子束光刻。讨论了这些技术随时间的演变及其在器件制造中的应用。还讨论了过去十年为提高这些设备的分辨率而开发的不同曝光工具。讨论了化学放大和非化学放大抗蚀剂及其键合和厚度。讨论了掩膜和无掩膜光刻技术及其优缺点。还讨论了微米和纳米尺度的器件制造。还提出了可用于提高这些技术性能的改进措施。