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二维器件和向硅线的集成。

Two-dimensional devices and integration towards the silicon lines.

机构信息

Shanghai Key Lab for Future Computing Hardware and System, School of Microelectronics, Fudan University, Shanghai, China.

State Key Laboratory of Silicon Materials, School of Micro-Nano Electronics & Materials Science and Engineering, Zhejiang University, Hangzhou, China.

出版信息

Nat Mater. 2022 Nov;21(11):1225-1239. doi: 10.1038/s41563-022-01383-2. Epub 2022 Oct 25.

DOI:10.1038/s41563-022-01383-2
PMID:36284239
Abstract

Despite technical efforts and upgrades, advances in complementary metal-oxide-semiconductor circuits have become unsustainable in the face of inherent silicon limits. New materials are being sought to compensate for silicon deficiencies, and two-dimensional materials are considered promising candidates due to their atomically thin structures and exotic physical properties. However, a potentially applicable method for incorporating two-dimensional materials into silicon platforms remains to be illustrated. Here we try to bridge two-dimensional materials and silicon technology, from integrated devices to monolithic 'on-silicon' (silicon as the substrate) and 'with-silicon' (silicon as a functional component) circuits, and discuss the corresponding requirements for material synthesis, device design and circuitry integration. Finally, we summarize the role played by two-dimensional materials in the silicon-dominated semiconductor industry and suggest the way forward, as well as the technologies that are expected to become mainstream in the near future.

摘要

尽管在技术上做出了努力并进行了升级,但面对硅材料固有的限制,互补金属氧化物半导体电路的发展已经难以为继。人们正在寻找新的材料来弥补硅的不足,而二维材料由于其原子级薄的结构和奇特的物理特性,被认为是很有前途的候选材料。然而,将二维材料纳入硅平台的一种潜在适用方法仍有待说明。在这里,我们尝试将二维材料和硅技术联系起来,从集成器件到单片“硅基(on-silicon)”(硅作为衬底)和“硅内(with-silicon)”(硅作为功能组件)电路,并讨论了相应的材料合成、器件设计和电路集成要求。最后,我们总结了二维材料在硅主导的半导体行业中所扮演的角色,并提出了未来的发展方向,以及预计在不久的将来成为主流的技术。

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