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集成硅光子微机电系统

Integrated silicon photonic MEMS.

作者信息

Quack Niels, Takabayashi Alain Yuji, Sattari Hamed, Edinger Pierre, Jo Gaehun, Bleiker Simon J, Errando-Herranz Carlos, Gylfason Kristinn B, Niklaus Frank, Khan Umar, Verheyen Peter, Mallik Arun Kumar, Lee Jun Su, Jezzini Moises, Morrissey Padraic, Antony Cleitus, O'Brien Peter, Bogaerts Wim

机构信息

École Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland.

School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney, Camperdown, NSW 2006 Australia.

出版信息

Microsyst Nanoeng. 2023 Mar 20;9:27. doi: 10.1038/s41378-023-00498-z. eCollection 2023.

Abstract

Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and quantum information processing. The success of silicon photonics has been enabled by the unique combination of performance, high yield, and high-volume capacity that can only be achieved by standardizing manufacturing technology. Today, standardized silicon photonics technology platforms implemented by foundries provide access to optimized library components, including low-loss optical routing, fast modulation, continuous tuning, high-speed germanium photodiodes, and high-efficiency optical and electrical interfaces. However, silicon's relatively weak electro-optic effects result in modulators with a significant footprint and thermo-optic tuning devices that require high power consumption, which are substantial impediments for very large-scale integration in silicon photonics. Microelectromechanical systems (MEMS) technology can enhance silicon photonics with building blocks that are compact, low-loss, broadband, fast and require very low power consumption. Here, we introduce a silicon photonic MEMS platform consisting of high-performance nano-opto-electromechanical devices fully integrated alongside standard silicon photonics foundry components, with wafer-level sealing for long-term reliability, flip-chip bonding to redistribution interposers, and fibre-array attachment for high port count optical and electrical interfacing. Our experimental demonstration of fundamental silicon photonic MEMS circuit elements, including power couplers, phase shifters and wavelength-division multiplexing devices using standardized technology lifts previous impediments to enable scaling to very large photonic integrated circuits for applications in telecommunications, neuromorphic computing, sensing, programmable photonics, and quantum computing.

摘要

硅光子学已成为一项成熟技术,有望在关键的新兴应用中发挥关键作用,这些应用包括超高速数据率光通信、自动驾驶车辆的距离传感、光子加速计算以及量子信息处理。硅光子学的成功得益于其性能、高成品率和高产量的独特组合,而这只有通过标准化制造技术才能实现。如今,由代工厂实施的标准化硅光子学技术平台可提供对优化库组件的访问,包括低损耗光路由、快速调制、连续调谐、高速锗光电二极管以及高效的光和电接口。然而,硅相对较弱的电光效应导致调制器占用面积较大,热光调谐器件功耗较高,这对硅光子学中的超大规模集成构成了重大障碍。微机电系统(MEMS)技术可以通过紧凑、低损耗、宽带、快速且功耗极低的构建模块来增强硅光子学。在此,我们介绍一种硅光子MEMS平台,该平台由高性能纳米光机电设备与标准硅光子学代工厂组件完全集成在一起,具有用于长期可靠性的晶圆级密封、倒装芯片键合到再分布中介层以及用于高端口数光和电接口的光纤阵列连接。我们使用标准化技术对基本硅光子MEMS电路元件(包括功率耦合器、移相器和波分复用器件)进行的实验演示消除了先前的障碍,从而能够扩展到用于电信、神经形态计算、传感、可编程光子学和量子计算的超大型光子集成电路。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/965d/10025267/1a0b9d68c8b1/41378_2023_498_Fig1_HTML.jpg

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