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用于高导电p型透明电极的溶液处理CuI:S的掺杂剂控制

Dopant Control of Solution-Processed CuI:S for Highly Conductive p-Type Transparent Electrode.

作者信息

Son Minki, Kim Ga Hye, Song Okin, Park ChanHu, Kwon Sunbum, Kang Joohoon, Ahn Kyunghan, Kim Myung-Gil

机构信息

School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea.

Department of Chemistry, Chung-Ang University, Seoul, 06974, Republic of Korea.

出版信息

Adv Sci (Weinh). 2024 Apr;11(14):e2308188. doi: 10.1002/advs.202308188. Epub 2024 Feb 1.

DOI:10.1002/advs.202308188
PMID:38303575
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11005697/
Abstract

Copper iodide (CuI) has garnered considerable attention as a promising alternative to p-type transparent conducting oxides owing to its low cation vacancy formation energy, shallow acceptor level, and readily modifiable conductivity via doping. Although sulfur (S) doping through liquid iodination has exhibited high efficacy in enhancing the conductivity with record high figure of merit (FOM) of 630 00 MΩ, solution-processed S-doped CuI (CuI:S) for low-cost large area fabrication has yet to be explored. Here, a highly conducting CuI:S thin-film for p-type transparent conducting electrode (TCE) is reported using low temperature solution-processing with thiourea derivatives. The optimization of thiourea dopant is determined through a comprehensive acid-base study, considering the effects of steric hindrance. The modification of active groups of thioureas facilitated a varying carrier concentration range of 9 × 10-2.52 × 10 cm and conductivities of 4.4-390.7 S cm. Consequently, N-ethylthiourea-doped CuI:S exhibited a FOM value of 7 600 MΩ, which is the highest value among solution-processed p-type TCEs to date. Moreover, the formulation of CuI:S solution for highly conductive p-type TCEs can be extended to CuI:S inks, facilitating high-throughput solution-processes such as inkjet printing and spray coating.

摘要

碘化铜(CuI)因其低阳离子空位形成能、浅受主能级以及易于通过掺杂改变电导率,作为p型透明导电氧化物的一种有前景的替代材料而备受关注。尽管通过液体碘化进行硫(S)掺杂在提高电导率方面表现出高效性,具有创纪录的63000 MΩ的高优值(FOM),但用于低成本大面积制造的溶液法制备的S掺杂CuI(CuI:S)尚未得到探索。在此,报道了一种使用硫脲衍生物通过低温溶液处理制备的用于p型透明导电电极(TCE)的高导电CuI:S薄膜。通过综合酸碱研究并考虑空间位阻效应来确定硫脲掺杂剂的优化。硫脲活性基团的修饰促进了载流子浓度在9×10¹⁹ - 2.52×10²⁰ cm⁻³范围内变化,电导率在4.4 - 390.7 S cm⁻¹之间。因此,N - 乙基硫脲掺杂的CuI:S表现出7600 MΩ的FOM值,这是迄今为止溶液法制备的p型TCE中最高的值。此外,用于高导电p型TCE的CuI:S溶液配方可以扩展到CuI:S油墨,便于进行诸如喷墨打印和喷涂等高通量溶液处理。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/13ec/11005697/29a6fe1705f9/ADVS-11-2308188-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/13ec/11005697/5504ae2637e7/ADVS-11-2308188-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/13ec/11005697/87bac820a70b/ADVS-11-2308188-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/13ec/11005697/536a1d08f1c7/ADVS-11-2308188-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/13ec/11005697/29a6fe1705f9/ADVS-11-2308188-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/13ec/11005697/5504ae2637e7/ADVS-11-2308188-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/13ec/11005697/87bac820a70b/ADVS-11-2308188-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/13ec/11005697/536a1d08f1c7/ADVS-11-2308188-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/13ec/11005697/29a6fe1705f9/ADVS-11-2308188-g005.jpg

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Hole-Doping to a Cu(I)-Based Semiconductor with an Isovalent Cation: Utilizing a Complex Defect as a Shallow Acceptor.用等价阳离子对铜(I)基半导体进行空穴掺杂:利用复合缺陷作为浅受主。
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Computational acceleration of prospective dopant discovery in cuprous iodide.
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