Suppr超能文献

单晶 MgBi 热电材料的塑性。

Plasticity in single-crystalline MgBi thermoelectric material.

机构信息

School of Materials Science and Engineering, and Institute of Materials Genome and Big Data, Harbin Institute of Technology (Shenzhen), Shenzhen, People's Republic of China.

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, People's Republic of China.

出版信息

Nature. 2024 Jul;631(8022):777-782. doi: 10.1038/s41586-024-07621-8. Epub 2024 Jul 10.

Abstract

Most of the state-of-the-art thermoelectric materials are inorganic semiconductors. Owing to the directional covalent bonding, they usually show limited plasticity at room temperature, for example, with a tensile strain of less than five per cent. Here we discover that single-crystalline MgBi shows a room-temperature tensile strain of up to 100 per cent when the tension is applied along the (0001) plane (that is, the ab plane). Such a value is at least one order of magnitude higher than that of traditional thermoelectric materials and outperforms many metals that crystallize in a similar structure. Experimentally, slip bands and dislocations are identified in the deformed MgBi, indicating the gliding of dislocations as the microscopic mechanism of plastic deformation. Analysis of chemical bonding reveals multiple planes with low slipping barrier energy, suggesting the existence of several slip systems in MgBi. In addition, continuous dynamic bonding during the slipping process prevents the cleavage of the atomic plane, thus sustaining a large plastic deformation. Importantly, the tellurium-doped single-crystalline MgBi shows a power factor of about 55 microwatts per centimetre per kelvin squared and a figure of merit of about 0.65 at room temperature along the ab plane, which outperforms the existing ductile thermoelectric materials.

摘要

大多数最先进的热电材料都是无机半导体。由于存在定向共价键,它们通常在室温下表现出有限的塑性,例如拉伸应变为小于 5%。在这里,我们发现当沿 (0001) 面(即 ab 面)施加张力时,单晶 MgBi 在室温下的拉伸应变高达 100%。这样的值至少比传统的热电材料高一个数量级,并且超过了许多具有相似结构的金属。实验中,在变形的 MgBi 中发现了滑移带和位错,表明位错的滑移是塑性变形的微观机制。化学键分析表明存在多个滑移势垒能量较低的平面,表明 MgBi 中存在多个滑移系统。此外,在滑移过程中连续的动态键合防止了原子面的劈裂,从而维持了较大的塑性变形。重要的是,碲掺杂的单晶 MgBi 在 ab 面沿室温方向的功率因子约为 55 微瓦每厘米每开尔文平方,品质因数约为 0.65,优于现有的延性热电材料。

文献检索

告别复杂PubMed语法,用中文像聊天一样搜索,搜遍4000万医学文献。AI智能推荐,让科研检索更轻松。

立即免费搜索

文件翻译

保留排版,准确专业,支持PDF/Word/PPT等文件格式,支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述,25分钟生成高质量综述,智能提取关键信息,辅助科研写作。

立即免费体验