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基于热载流子受激辐射的热发射器晶体管。

A hot-emitter transistor based on stimulated emission of heated carriers.

机构信息

Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China.

School of Materials Science and Engineering, University of Science and Technology of China, Shenyang, China.

出版信息

Nature. 2024 Aug;632(8026):782-787. doi: 10.1038/s41586-024-07785-3. Epub 2024 Aug 14.

DOI:10.1038/s41586-024-07785-3
PMID:39143208
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11338824/
Abstract

Hot-carrier transistors are a class of devices that leverage the excess kinetic energy of carriers. Unlike regular transistors, which rely on steady-state carrier transport, hot-carrier transistors modulate carriers to high-energy states, resulting in enhanced device speed and functionality. These characteristics are essential for applications that demand rapid switching and high-frequency operations, such as advanced telecommunications and cutting-edge computing technologies. However, the traditional mechanisms of hot-carrier generation are either carrier injection or acceleration, which limit device performance in terms of power consumption and negative differential resistance. Mixed-dimensional devices, which combine bulk and low-dimensional materials, can offer different mechanisms for hot-carrier generation by leveraging the diverse potential barriers formed by energy-band combinations. Here we report a hot-emitter transistor based on double mixed-dimensional graphene/germanium Schottky junctions that uses stimulated emission of heated carriers to achieve a subthreshold swing lower than 1 millivolt per decade beyond the Boltzmann limit and a negative differential resistance with a peak-to-valley current ratio greater than 100 at room temperature. Multi-valued logic with a high inverter gain and reconfigurable logic states are further demonstrated. This work reports a multifunctional hot-emitter transistor with significant potential for low-power and negative-differential-resistance applications, marking a promising advancement for the post-Moore era.

摘要

热载流子晶体管是一类利用载流子过剩动能的器件。与依赖稳态载流子输运的常规晶体管不同,热载流子晶体管将载流子调制到高能态,从而提高了器件的速度和功能。这些特性对于需要快速开关和高频操作的应用至关重要,如先进的电信和前沿计算技术。然而,传统的热载流子产生机制要么是载流子注入,要么是载流子加速,这在功耗和负微分电阻方面限制了器件的性能。混合维度器件将体材料和低维材料结合在一起,可以通过利用由能带组合形成的不同势垒来提供热载流子产生的不同机制。在这里,我们报告了一种基于双层混合维度石墨烯/锗肖特基结的热发射极晶体管,该晶体管利用加热载流子的受激辐射,实现了低于 1 毫伏每 decade 的亚阈值摆幅,低于玻尔兹曼极限,并且在室温下具有大于 100 的峰值-谷电流比的负微分电阻。进一步演示了具有高逆变器增益和可重构逻辑状态的多值逻辑。这项工作报告了一种具有多功能的热发射极晶体管,具有低功耗和负微分电阻应用的巨大潜力,为后摩尔时代的发展带来了希望。

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