Wang Yaoyu, Yi Chenqi, Tian Wenxiang, Liu Feng, Cheng Gary J
Institute of Technological Sciences, Wuhan University, Wuhan, China.
State Key Laboratory of Water Resources Engineering and Management, Wuhan University & Changjiang Institute of Survey, Planning, Design and Research Corporation, Wuhan, P.R. China.
Nat Mater. 2024 Dec;23(12):1645-1653. doi: 10.1038/s41563-024-01984-z. Epub 2024 Aug 21.
Nanoscale three-dimensional (3D) printing of metals and alloys has faced challenges in speed, miniaturization and deficiency in material properties. Traditional nanomanufacturing relies on lithographic methods with material constraints, limited resolution and slow layer-by-layer processing. This work introduces polymer-free techniques using two-photon decomposition and optical force trapping for free-space direct 3D printing of metals, metal oxides and multimetallic alloys with resolutions beyond optical limits. This method involves the two-photon decomposition of metal atoms from precursors, rapid assembly into nanoclusters via optical forces and ultrafast laser sintering, yielding dense, smooth nanostructures. Enhanced near-field optical forces from laser-induced localized surface plasmon resonance facilitate nanocluster aggregation. Our approach eliminates the need for organic materials, layer-by-layer printing and complex post-processing. Printed Mo nanowires show an excellent mechanical performance, closely resembling the behaviour of single crystals, while Mo-Co-W alloy nanowires outperform Mo nanowires. This innovation promises the customizable 3D nanoprinting of high-quality metals and metal oxides, impacting nanoelectronics, nanorobotics and advanced chip manufacturing.
金属和合金的纳米级三维(3D)打印在速度、小型化以及材料性能缺陷方面面临挑战。传统的纳米制造依赖光刻方法,存在材料限制、分辨率有限以及逐层加工速度慢等问题。这项工作引入了无聚合物技术,利用双光子分解和光力捕获实现金属、金属氧化物和多金属合金的自由空间直接3D打印,分辨率超越光学极限。该方法涉及从前体中双光子分解金属原子,通过光力快速组装成纳米团簇并进行超快激光烧结,从而产生致密、光滑的纳米结构。激光诱导的局域表面等离子体共振增强的近场光力促进了纳米团簇的聚集。我们的方法无需有机材料、逐层打印和复杂的后处理。打印的钼纳米线表现出优异的机械性能,与单晶行为极为相似,而钼-钴-钨合金纳米线的性能优于钼纳米线。这项创新有望实现高质量金属和金属氧化物的可定制3D纳米打印,对纳米电子学、纳米机器人技术和先进芯片制造产生影响。