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与III族氮化物半导体轻松形成范德华金属接触。

Facile formation of van der Waals metal contact with III-nitride semiconductors.

作者信息

Sun Xiyu, Wang Danhao, Wu Xiaojing, Zhang Jiahao, Lin Yangjian, Luo Dongyang, Li Fang, Zhang Haochen, Chen Wei, Liu Xin, Kang Yang, Yu Huabin, Luo Yuanmin, Ge Binghui, Sun Haiding

机构信息

iGaN Laboratory, School of Microelectronics, University of Science and Technology of China, Hefei 230029, China.

Information Materials and Intelligent Sensing Laboratory of Anhui Province, Institutes of Physical Science and Information Technology, Anhui University, Hefei 230601, China.

出版信息

Sci Bull (Beijing). 2024 Dec 15;69(23):3692-3699. doi: 10.1016/j.scib.2024.09.028. Epub 2024 Sep 24.

Abstract

Metal-semiconductor contacts play a pivotal role in controlling carrier transport in the fabrication of modern electronic devices. The exploration of van der Waals (vdW) metal contacts in semiconductor devices can potentially mitigate Fermi-level pinning at the metal-semiconductor interface, with particular success in two-dimensional layered semiconductors, triggering unprecedented electrical and optical characteristics. In this work, for the first time, we report the direct integration of vdW metal contacts with bulk wide bandgap gallium nitride (GaN) by employing a dry transfer technique. High-angle annular dark-field scanning transmission electron microscopy explicitly illustrates the existence of a vdW gap between the metal electrode and GaN. Strikingly, compared with devices fabricated with electron beam-evaporated metal contacts, the vdW contact device exhibits a responsivity two orders of magnitude higher with a significantly suppressed dark current in the nanoampere range. Furthermore, by leveraging the high responsivity and persistent photoconductivity obtained from vdW contact devices, we demonstrate imaging, wireless optical communication, and neuromorphic computing functionality. The integration of vdW contacts with bulk semiconductors offers a promising architecture to overcome device fabrication challenges, forming nearly ideal metal-semiconductor contacts for future integrated electronics and optoelectronics.

摘要

金属-半导体接触在现代电子器件制造中对控制载流子传输起着关键作用。在半导体器件中探索范德华(vdW)金属接触有可能减轻金属-半导体界面处的费米能级钉扎,在二维层状半导体中取得了特别的成功,引发了前所未有的电学和光学特性。在这项工作中,我们首次通过采用干法转移技术报道了vdW金属接触与体相宽带隙氮化镓(GaN)的直接集成。高角度环形暗场扫描透射电子显微镜清楚地表明了金属电极与GaN之间存在vdW间隙。引人注目的是,与采用电子束蒸发金属接触制造的器件相比,vdW接触器件的响应度高出两个数量级,暗电流显著抑制在纳安范围内。此外,通过利用从vdW接触器件获得的高响应度和持续光电导性,我们展示了成像、无线光通信和神经形态计算功能。vdW接触与体相半导体的集成提供了一种有前景的架构,以克服器件制造挑战,为未来的集成电子学和光电子学形成近乎理想的金属-半导体接触。

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