Azamatov Bagdat, Dzhes Alexey, Borisov Alexander, Kaliyev Daniyar, Maratuly Bauyrzhan, Sagidugumar Amangeldi, Alexandr Myakinin, Turlybekuly Amanzhol, Plotnikov Sergei
D. Serikbayev East Kazakhstan Technical University, Oskemen, 070000, Kazakhstan.
Institute of Materials Engineering LLP, Astana, 010000, Kazakhstan.
Heliyon. 2024 Dec 12;11(1):e41130. doi: 10.1016/j.heliyon.2024.e41130. eCollection 2025 Jan 15.
This study evaluates the antibacterial properties and physicochemical characteristics of -tantalum-copper (Ta-Cu) coatings deposited on titanium alloy substrates using high-power magnetron sputtering. Implant-associated infections, particularly those caused by bacterial adhesion and biofilm formation, pose significant challenges in the field of orthopedic and dental implants. To address these issues, Ta-Cu coatings with varying copper content (∼3.0 wt%, ∼10 wt%, ∼17 wt% for TaCu-1, TaCu-2, and TaCu-3, respectively) and different thermal treatment conditions (400 °C, 500 °C, 600 °C) were assessed for their antibacterial efficacy against and . The study utilized both the diffusion into agar method and the time-kill test to evaluate antibacterial activity. Results indicate that the TaCu-2 sample, particularly when annealed at 600 °C, demonstrated the highest bactericidal activity, especially against and . The findings highlight the critical role of optimizing both copper content and annealing temperature in enhancing the antibacterial properties of Cu-Ta coatings, making them promising candidates for preventing implant-associated infections.
本研究评估了采用高功率磁控溅射法在钛合金基体上沉积的钽铜（Ta-Cu）涂层的抗菌性能和物理化学特性。植入相关感染，尤其是由细菌粘附和生物膜形成引起的感染，在骨科和牙科植入领域构成了重大挑战。为了解决这些问题，对具有不同铜含量（TaCu-1、TaCu-2和TaCu-3的铜含量分别约为3.0 wt%、约10 wt%、约17 wt%）和不同热处理条件（400°C、500°C、600°C）的Ta-Cu涂层针对[具体细菌1]和[具体细菌2]的抗菌效果进行了评估。该研究利用琼脂扩散法和时间-杀菌试验来评估抗菌活性。结果表明，TaCu-2样品，特别是在600°C退火时，表现出最高的杀菌活性，尤其是针对[具体细菌1]和[具体细菌2]。研究结果突出了优化铜含量和退火温度在增强Cu-Ta涂层抗菌性能方面的关键作用，使其成为预防植入相关感染的有前景的候选材料。
