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一种基于互补二维材料的单指令集计算机。

A complementary two-dimensional material-based one instruction set computer.

作者信息

Ghosh Subir, Zheng Yikai, Rafiq Musaib, Ravichandran Harikrishnan, Sun Yongwen, Chen Chen, Goswami Mrinmoy, Sakib Najam U, Sadaf Muhtasim Ul Karim, Pannone Andrew, Ray Samriddha, Redwing Joan M, Yang Yang, Sahay Shubham, Das Saptarshi

机构信息

Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA, USA.

Electrical Engineering, Indian Institute of Technology Kanpur, Kanpur, India.

出版信息

Nature. 2025 Jun;642(8067):327-335. doi: 10.1038/s41586-025-08963-7. Epub 2025 Jun 11.

Abstract

Silicon has enabled advancements in semiconductor technology through miniaturization, but scaling challenges necessitate the exploration of new materials. Two-dimensional (2D) materials, with their atomic thickness and high carrier mobility, offer a promising alternative. Although significant progress has been made in wafer-scale growth, high-performance field-effect transistors and circuits based on 2D materials, achieving complementary metal-oxide-semiconductor (CMOS) integration remains a challenge. Here, we present a 2D one instruction set computer based on CMOS technology, leveraging the heterogeneous integration of large-area n-type MoS and p-type WSe field-effect transistors. By scaling the channel length, incorporating a high-κ gate dielectric and optimizing material growth and device postprocessing, we tailored the threshold voltages for both n- and p-type 2D field-effect transistors, achieving high drive currents and reduced subthreshold leakage. This enabled circuit operation below 3 V with an operating frequency of up to 25 kHz, which was constrained by parasitic capacitances, along with ultra-low power consumption in the picowatt range and a switching energy as low as approximately 100 pJ. Finally, we projected the performance of the one instruction set computer and benchmarked it against state-of-the-art silicon technology using an industry-standard SPICE-compatible BSIM-BULK model. This model was calibrated with experimental data that incorporate device-to-device variations. Although further advances are needed, this work marks a significant milestone in the application of 2D materials to microelectronics.

摘要

硅通过小型化推动了半导体技术的进步,但缩放挑战使得探索新材料成为必要。二维(2D)材料因其原子厚度和高载流子迁移率,提供了一种有前景的替代方案。尽管在晶圆级生长、基于二维材料的高性能场效应晶体管和电路方面已取得显著进展,但实现互补金属氧化物半导体(CMOS)集成仍然是一项挑战。在此,我们展示了一种基于CMOS技术的二维单指令集计算机,利用大面积n型MoS和p型WSe场效应晶体管的异质集成。通过缩放沟道长度、引入高κ栅介质以及优化材料生长和器件后处理,我们调整了n型和p型二维场效应晶体管的阈值电压,实现了高驱动电流并降低了亚阈值泄漏。这使得电路能够在3V以下运行,工作频率高达25kHz,其受寄生电容限制,同时功耗在皮瓦范围内超低,开关能量低至约100pJ。最后,我们预测了单指令集计算机的性能,并使用行业标准的与SPICE兼容的BSIM - BULK模型将其与最先进的硅技术进行了基准测试。该模型用包含器件间变化的实验数据进行了校准。尽管还需要进一步改进,但这项工作标志着二维材料在微电子应用方面的一个重要里程碑。

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