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酿酒酵母中两种不同类型的双链断裂通过类似的不依赖RAD52的非同源重组事件进行修复。

Two different types of double-strand breaks in Saccharomyces cerevisiae are repaired by similar RAD52-independent, nonhomologous recombination events.

作者信息

Kramer K M, Brock J A, Bloom K, Moore J K, Haber J E

机构信息

Rosenstiel Basic Medical Sciences Research Center, Brandeis University, Waltham, Massachusetts 02254-9110.

出版信息

Mol Cell Biol. 1994 Feb;14(2):1293-301. doi: 10.1128/mcb.14.2.1293-1301.1994.

Abstract

In haploid rad52 Saccharomyces cerevisiae strains unable to undergo homologous recombination, a chromosomal double-strand break (DSB) can be repaired by imprecise rejoining of the broken chromosome ends. We have used two different strategies to generate broken chromosomes: (i) a site-specific DSB generated at the MAT locus by HO endonuclease cutting or (ii) a random DSB generated by mechanical rupture during mitotic segregation of a conditionally dicentric chromosome. Broken chromosomes were repaired by deletions that were highly variable in size, all of which removed more sequences than was required either to prevent subsequent HO cleavage or to eliminate a functional centromere, respectively. The junction of the deletions frequently occurred where complementary strands from the flanking DNA could anneal to form 1 to 5 bp, although 12% (4 of 34) of the events appear to have occurred by blunt-end ligation. These types of deletions are very similar to the junctions observed in the repair of DSBs by mammalian cells (D. B. Roth and J. H. Wilson, Mol. Cell. Biol. 6:4295-4304, 1986). When a high level of HO endonuclease, expressed in all phases of the cell cycle, was used to create DSBs, we also recovered a large class of very small (2- or 3-bp) insertions in the HO cleavage site. These insertions appear to represent still another mechanism of DSB repair, apparently by annealing and filling in the overhanging 3' ends of the cleavage site. These types of events have also been well documented for vertebrate cells.

摘要

在单倍体的酿酒酵母rad52菌株中,由于无法进行同源重组,染色体双链断裂(DSB)可通过断裂染色体末端的不精确重新连接来修复。我们采用了两种不同的策略来产生断裂染色体:(i)通过HO内切酶切割在MAT位点产生位点特异性DSB,或(ii)在有条件双着丝粒染色体的有丝分裂分离过程中通过机械断裂产生随机DSB。断裂染色体通过大小高度可变的缺失进行修复,所有这些缺失去除的序列都比分别防止后续HO切割或消除功能性着丝粒所需的序列更多。缺失的连接处经常出现在侧翼DNA的互补链可以退火形成1至5个碱基对的地方,尽管12%(34个事件中的4个)的事件似乎是通过平端连接发生的。这些类型的缺失与哺乳动物细胞修复DSB时观察到的连接处非常相似(D. B. Roth和J. H. Wilson,《分子细胞生物学》6:4295 - 4304,1986)。当使用在细胞周期所有阶段都表达的高水平HO内切酶来产生DSB时,我们还在HO切割位点回收了一大类非常小的(2或3个碱基对)插入。这些插入似乎代表了DSB修复的另一种机制,显然是通过退火并填补切割位点突出的3'末端。这些类型的事件在脊椎动物细胞中也有充分的记录。

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