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暗态进展表明在180至240开尔文之间辐射损伤的时间尺度较慢。

Dark progression reveals slow timescales for radiation damage between T = 180 and 240 K.

作者信息

Warkentin Matthew, Badeau Ryan, Hopkins Jesse, Thorne Robert E

机构信息

Physics Department, Cornell University, Ithaca, NY 14853, USA.

出版信息

Acta Crystallogr D Biol Crystallogr. 2011 Sep;67(Pt 9):792-803. doi: 10.1107/S0907444911027600. Epub 2011 Aug 9.

Abstract

Can radiation damage to protein crystals be outrun' by collecting a structural data set before damage is manifested? Recent experiments using ultra-intense pulses from a free-electron laser show that the answer is yes. Here, evidence is presented that significant reductions in global damage at temperatures above 200 K may be possible using conventional X-ray sources and current or soon-to-be available detectors. Specifically, dark progression' (an increase in damage with time after the X-rays have been turned off) was observed at temperatures between 180 and 240 K and on timescales from 200 to 1200 s. This allowed estimation of the temperature-dependent timescale for damage. The rate of dark progression is consistent with an Arrhenius law with an activation energy of 14 kJ mol(-1). This is comparable to the activation energy for the solvent-coupled diffusive damage processes responsible for the rapid increase in radiation sensitivity as crystals are warmed above the glass transition near 200 K. Analysis suggests that at T = 300 K data-collection times of the order of 1 s (and longer at lower temperatures) may allow significant reductions in global radiation damage, facilitating structure solution on crystals with liquid solvent. No dark progression was observed below T = 180 K, indicating that no important damage process is slowed through this timescale window in this temperature range.

摘要

在蛋白质晶体的辐射损伤显现之前收集结构数据集,能否“避开”这种损伤?最近利用自由电子激光的超强脉冲进行的实验表明答案是肯定的。在此,有证据表明,使用传统X射线源以及当前或即将可用的探测器,在温度高于200 K时可能大幅减少整体损伤。具体而言,在180至240 K的温度范围内以及200至1200 s的时间尺度上观察到了“暗进程”(X射线关闭后损伤随时间增加)。这使得能够估算出与温度相关的损伤时间尺度。暗进程速率符合阿伦尼乌斯定律,活化能为14 kJ mol⁻¹。这与溶剂耦合扩散损伤过程的活化能相当,该过程导致晶体温度升高至接近200 K的玻璃化转变温度以上时辐射敏感性迅速增加。分析表明,在T = 300 K时,约1 s的数据收集时间(在较低温度下更长)可能会显著减少整体辐射损伤,有助于解析含液态溶剂晶体的结构。在T < 180 K时未观察到暗进程,这表明在该温度范围内,在此时间尺度窗口内没有重要的损伤过程会减缓。

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