Leonardi Antonio Alessio, Lo Faro Maria José, Irrera Alessia
Consiglio Nazionale delle Ricerche - Instituto Processi Chimico-Fisici (CNR-IPCF) , Viale F. Stagno D'Alcontres 37, 98158 Messina, Italy.
Dipartimento di Fisica ed Astronomia, Università di Catania, Via Santa Sofia 64, 95123 Catania, Italy.
Nanomaterials (Basel). 2020 May 18;10(5):966. doi: 10.3390/nano10050966.
Silicon nanowires (Si NWs) are emerging as an innovative building block in several fields, such as microelectronics, energetics, photonics, and sensing. The interest in Si NWs is related to the high surface to volume ratio and the simpler coupling with the industrial flat architecture. In particular, Si NWs emerge as a very promising material to couple the light to silicon. However, with the standard synthesis methods, the realization of quantum-confined Si NWs is very complex and often requires expensive equipment. Metal-Assisted Chemical Etching (MACE) is gaining more and more attention as a novel approach able to guarantee high-quality Si NWs and high density with a cost-effective approach. Our group has recently modified the traditional MACE approach through the use of thin metal films, obtaining a strong control on the optical and structural properties of the Si NWs as a function of the etching process. This method is Complementary Metal-Oxide-Semiconductors (CMOS)-technology compatible, low-cost, and permits us to obtain a high density, and room temperature light-emitting Si NWs due to the quantum confinement effect. A strong control on the Si NWs characteristics may pave the way to a real industrial transfer of this fabrication methodology for both microelectronics and optoelectronics applications.
硅纳米线(Si NWs)正在成为微电子、能源、光子学和传感等多个领域的一种创新构件。对Si NWs的关注与高表面体积比以及与工业平面架构更简单的耦合有关。特别是,Si NWs成为将光与硅耦合的一种非常有前途的材料。然而,采用标准合成方法时,实现量子限制的Si NWs非常复杂,且通常需要昂贵的设备。金属辅助化学蚀刻(MACE)作为一种能够以经济高效的方法保证高质量Si NWs和高密度的新方法,正越来越受到关注。我们小组最近通过使用金属薄膜对传统MACE方法进行了改进,能够根据蚀刻过程对Si NWs的光学和结构特性进行强有力的控制。这种方法与互补金属氧化物半导体(CMOS)技术兼容、成本低,并且由于量子限制效应,使我们能够获得高密度且室温发光的Si NWs。对Si NWs特性的强有力控制可能为这种制造方法在微电子和光电子应用中的实际工业转移铺平道路。