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基于碳化硅衬底的氮化镓光电导半导体开关特性研究与损伤分析

Properties Investigation and Damage Analysis of GaN Photoconductive Semiconductor Switch Based on SiC Substrate.

作者信息

Xu Jiankai, Jiang Lijuan, Cai Ping, Feng Chun, Xiao Hongling, Wang Xiaoliang

机构信息

Laboratory of Solid State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.

Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.

出版信息

Micromachines (Basel). 2024 Sep 24;15(10):1178. doi: 10.3390/mi15101178.

DOI:10.3390/mi15101178
PMID:39459052
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11509565/
Abstract

The GaN photoconductive semiconductor switches (PCSSs) with low leakage current and large on-state current are suitable for several applications, including fast switching and high-power electromagnetic pulse equipment. This paper demonstrates a high-power GaN lateral PCSS device. An output peak current of 142.2 A is reached with an input voltage of 10.28 kV when the GaN lateral PCSS is intrinsically triggered. In addition, the method of retaining the AlGaN/GaN heterostructure between electrodes on PCSSs is proposed, which results in increasing the output peak current of the PCSS. The damage mechanism of the PCSS caused by a high electric field and high excitation laser energy is analyzed. The obtained results show that the high heat generated by the large current leads to the decomposition of GaN, and thus, the Ga forms a metal conductive path, resulting in the failure of the device.

摘要

具有低漏电流和大导通态电流的氮化镓光电导半导体开关(PCSS)适用于多种应用,包括快速开关和高功率电磁脉冲设备。本文展示了一种高功率氮化镓横向PCSS器件。当氮化镓横向PCSS被本征触发时,在输入电压为10.28 kV的情况下,输出峰值电流达到142.2 A。此外,提出了在PCSS的电极之间保留AlGaN/GaN异质结构的方法,这导致PCSS的输出峰值电流增加。分析了高电场和高激发激光能量对PCSS造成的损伤机制。所得结果表明,大电流产生的高热量导致氮化镓分解,从而使镓形成金属导电路径,导致器件失效。

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Challenges and Opportunities for High-Power and High-Frequency AlGaN/GaN High-Electron-Mobility Transistor (HEMT) Applications: A Review.高功率和高频氮化铝镓/氮化镓高电子迁移率晶体管(HEMT)应用面临的挑战与机遇:综述
Micromachines (Basel). 2022 Dec 1;13(12):2133. doi: 10.3390/mi13122133.
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The Evolution of Manufacturing Technology for GaN Electronic Devices.
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Micromachines (Basel). 2021 Jun 23;12(7):737. doi: 10.3390/mi12070737.
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The Influence of the Different Repair Methods on the Electrical Properties of the Normally off p-GaN HEMT.不同修复方法对常关型p-GaN高电子迁移率晶体管电学性能的影响
Micromachines (Basel). 2021 Jan 26;12(2):131. doi: 10.3390/mi12020131.
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