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用于硅技术的石墨烯和二维材料。

Graphene and two-dimensional materials for silicon technology.

机构信息

Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX, USA.

IMEC, Leuven, Belgium.

出版信息

Nature. 2019 Sep;573(7775):507-518. doi: 10.1038/s41586-019-1573-9. Epub 2019 Sep 25.

Abstract

The development of silicon semiconductor technology has produced breakthroughs in electronics-from the microprocessor in the late 1960s to early 1970s, to automation, computers and smartphones-by downscaling the physical size of devices and wires to the nanometre regime. Now, graphene and related two-dimensional (2D) materials offer prospects of unprecedented advances in device performance at the atomic limit, and a synergistic combination of 2D materials with silicon chips promises a heterogeneous platform to deliver massively enhanced potential based on silicon technology. Integration is achieved via three-dimensional monolithic construction of multifunctional high-rise 2D silicon chips, enabling enhanced performance by exploiting the vertical direction and the functional diversification of the silicon platform for applications in opto-electronics and sensing. Here we review the opportunities, progress and challenges of integrating atomically thin materials with silicon-based nanosystems, and also consider the prospects for computational and non-computational applications.

摘要

硅半导体技术的发展在电子学领域取得了突破——从上世纪 60 年代末到 70 年代初的微处理器,到自动化、计算机和智能手机——通过将设备和电线的物理尺寸缩小到纳米尺度。现在,石墨烯和相关的二维(2D)材料有望在原子极限下实现前所未有的器件性能进步,而 2D 材料与硅芯片的协同组合有望提供一个异构平台,基于硅技术实现潜在的巨大增强。通过多功能高层 2D 硅芯片的三维整体构建实现集成,通过利用垂直方向和硅平台的功能多样化来实现增强的性能,适用于光电子学和传感应用。在这里,我们回顾了将原子层薄材料与基于硅的纳米系统集成的机会、进展和挑战,同时也考虑了计算和非计算应用的前景。

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